HCS11MS Intersil Corporation, HCS11MS Datasheet - Page 6

• Manufacturer Part Number: HCS11MS
• Description: Radiation Hardened Triple 3-Input AND Gate
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
DIE ATTACH:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
87 x 88 mils
2.20 x 2.24mm
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
Material: Silver Epoxy
<2.0 x 10
100 m x 100 m
4 x 4 mils
B1 (2)
A2 (3)
B2 (4)
C2 (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
A1
(1)
(6)
Y2
HCS11MS
HCS11MS
GND
7-140
VCC
(14)
(7)
(13)
(8)
Y3
C1
(12) Y1
(11) C3
(10) B3
(9) A3