L6668_06 STMICROELECTRONICS [STMicroelectronics], L6668_06 Datasheet - Page 21

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L6668_06

Manufacturer Part Number
L6668_06
Description
SMART PRIMARY CONTROLLER
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
5
In order to meet environmental requirements, STMicroelectronics offers this device in ECOPACK
age. This package has a Lead-free second level interconnect. The category of second level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK
is an STMicroelectronics trademark.
ECOPACK specifications are available at: www.st.com.
Figure 47. SO16 (Narrow) Mechanical Data & Package Dimensions
Package information
(1) "D" and "F" do not include mold flash or protrusions - Mold
DIM.
D
F
a1
a2
b1
c1
e3
M
A
C
E
G
S
b
e
L
(1)
(1)
flash or protrusions shall not exceed 0.15mm (.006inc.)
MIN.
0.35
0.19
4.60
0.1
9.8
5.8
3.8
0.4
TYP.
1.27
8.89
mm
0.5
MAX.
1.75
0.25
0.46
0.25
5.30
1.27
0.62
45°
1.6
6.2
4.0
10
8 ° (max.)
0.004
0.014
0.007
0.386
0.228
0.150
0.181
0.150
(typ.)
MIN.
0.020
0.050
0.350
inch
TYP.
MAX.
0.069
0.009
0.063
0.018
0.010
0.394
0.244
0.157
0.208
0.050
0.024
MECHANICAL DATA
SO16 (Narrow)
OUTLINE AND
0016020 D
®
L6668
pack-
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