nup4301 ON Semiconductor, nup4301 Datasheet - Page 3

• Manufacturer Part Number: nup4301
• Description: Low Capacitance Diode Array For Esd Protection In Four Data Lines
• Manufacturer: ON Semiconductor

0.05 (0.002)
H
E
e
A1
6
1
D
5
2
3
4
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.075
1.9
b
A
E
0.037
0.037
0.95
0.95
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
NUP4301MR6T1
http://onsemi.com
L
CASE 318F−05
TSOP−6
ISSUE L
C
3
0.094
2.4
q
SCALE 10:1
0.039
1.0
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318F−01, −02, −03 OBSOLETE. NEW
DIM
H
A1
A
b
c
D
E
e
L
q
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
STANDARD 318F−04.
E
inches
mm
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
0.028
0.7
MILLIMETERS
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
−
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
MIN
0°
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
MAX
0.118
10°