ST72325 STMICROELECTRONICS [STMicroelectronics], ST72325 Datasheet - Page 178

• Manufacturer Part Number: ST72325
• Description: 8-BIT MCU WITH 16 TO 60K FLASH/ROM, ADC, CSS, FIVE TIMERS, SPI, SCI, I2C INTERFACE
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ST72325
13.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages will be converted
in 2005 to lead-free technology, named ECO-
PACK
PCN CRP/04/744 "Lead-free Conversion Program
- Compliance with RoHS", issued November 18th,
2004).
■
■
Table 29. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
178/193
TQFP
ECOPACK
to the JEDEC STD-020B compliant soldering
profile.
Detailed information on the STMicroelectronic
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
(for a detailed roadmap, please refer to
TM
TM
aspects
(AN2033,
packages are qualified according
transition program is available on
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP Pb-packages are compatible with Lead-
ible with Lead (Pb) containing soldering process
(see application note AN2034)
free soldering process, nevertheless it's the cus-
tomer's duty to verify that the Pb-packages max-
imum temperature (mentioned on the Inner box
label) is compatible with their Lead-free soldering
temperature.
Pb solder paste
Yes
TM
TQFP packages are fully compat-
Pb-free solder paste
Yes *