89ttm553 Integrated Device Technology, 89ttm553 Datasheet - Page 13

• Manufacturer Part Number: 89ttm553
• Description: Traffic Manager Co-processing Engine
• Manufacturer: Integrated Device Technology

AC Test Conditions
AC Test Conditions
AC Test Conditions
AC Test Conditions
89TTM553 Thermal Consideration
89TTM553 Thermal Considerations s s s
89TTM553 Thermal Consideration
89TTM553 Thermal Consideration
IDT 89TTM553
This section describes the temperature and heat sink calculations for flip-chip BGA devices.
The thermal circuit is as shown below.
Input Rise/Fall Time
Output timing measurement reference level (V
Output load
Symbol
Ø
Ø
Ø
JC
JA
JB
For output timing
Thermal resistance, junction to ambient (no heat sink)
Estimated thermal resistance, junction to board
Thermal resistance, junction to case
Z0 = 50
Total Power
= W
Device
20 pF
Parameter
REF
Table 19 89TTM553 Thermal Characteristics
) for 3.3V interfaces
T
Figure 2 89TTM553 Thermal Circuit
J
Table 18 AC Test Conditions
50
V
Figure 1 AC Test Load
REF
Ø
Ø
JC
JB
13 of 30
W1
W2 (dissipated through board)
Ø
CA
For enable/disable spec
Value Units
T
T
A
A
9.8
7.8
3.1
0.7
5 pF
1 V / ns (20% / 80%)
(VDDQ/2) V
As shown in Figure 1
°C / W
°C / W
°C / W
°C / W
VDD
75
75
Typical: 200 FPM.
Conditions
Max: still air.
March 3, 2005