k4h2g0638a-uc Samsung Semiconductor, Inc., k4h2g0638a-uc Datasheet - Page 5

• Manufacturer Part Number: k4h2g0638a-uc
• Description: Stacked 2gb A-die Sdram Specification
• Manufacturer: Samsung Semiconductor, Inc.

DDR SDRAM stacked 2Gb A-die (x4)
4.0 Pin Description
AP/A
V
V
V
CAS
RAS
V
V
CS0
CS1
DM is internally loaded to match DQ and DQS identically.
DQ
DQ
BA
BA
V
V
WE
V
NC
DDQ
NC
NC
NC
DDQ
NC
NC
NC
DDQ
NC
A
NC
NC
SSQ
SSQ
A
A
A
A
Organization
DD
DD
DD
13
10
st. 512Mx4
0
1
0
1
0
1
2
3
Row & Column address configuration
stacked 2Gb TSOP-II Package Pinout
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
24
25
26
27
28
29
30
31
32
33
(0.65mm Pin Pitch)
(400mil x 875mil)
st.512Mb x 4
Bank Address
Auto Precharge
66Pin TSOPII
BA0~BA1
Row Address
A10
A0~A13
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
Column Address
A0-A9, A11, A12
V
NC
V
NC
DQ
V
NC
NC
V
NC
DQ
V
NC
NC
V
DQS
NC
V
V
DM
CK
CK
CKE0
CKE1
A
A
A
A
A
A
A
A
V
SS
SSQ
DDQ
SSQ
DDQ
SSQ
REF
SS
SS
12
11
9
8
7
6
5
4
3
2
Rev. 0.0 June. 2005
DDR SDRAM
Preliminary