hys64d32020hdl-6-c Infineon Technologies Corporation, hys64d32020hdl-6-c Datasheet - Page 16

• Manufacturer Part Number: hys64d32020hdl-6-c
• Description: 200-pin Small Outline Dual-in-line Memory Modules
• Manufacturer: Infineon Technologies Corporation

Table 8
Part Number & Organization
Symbol
I
I
I
I
I
I
I
I
I
I
I
I
1) Module
2) Test condition for maximum values:
3) The module
4) DQ I/O (
5) The module
Data Sheet
DD0
DD1
DD2P
DD2F
DD2Q
DD3P
DD3N
DD4R
DD4W
DD5
DD6
DD7
capacity.
m
modules
I
DDx
I
I
DD
[component] + n
DDQ
I
DD
values are calculated on the basis of component
I
I
) currents are not included in the calculations (see note 1)
DDx
DDx
Specification
values are calculated from the
values are calculated from the corrponent
I
DD3N
[component] with m and n number of components of rank 1 and 2; n=0 for 1 rank
HYS64D16000HDL–6–C
128MB
1 Rank
–6
typ.
260
320
14
100
320
44
136
340
360
540
6
820
V
64
DD
= 2.7 V,
I
DDx
T
max.
300
380
18
120
96
60
160
400
440
640
6
960
A
= 10 ° C
values of the component data sheet as follows:
16
I
I
DDx
DD
and can be measured differently according to DQ loading
data sheet values as: (m + n)
HYS64D32020HDL–6–C
256MB
2 Ranks
–6
typ.
396
456
28
200
640
88
272
476
496
676
11
956
Small Outline DDR SDRAM Modules
64
HYS64D[32020/16000]HDL–6–C
max.
460
540
36
240
192
120
320
560
600
800
11
1120
Electrical Characteristics
I
DDx
Rev. 0.5, 2003-08
[component]
Unit Note
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
3)
3)4)
5)
5)
5)
5)
5)
3)4)
3)
3)
5)
3)4)
1)2)