hys64d32020hdl-6-c Infineon Technologies Corporation, hys64d32020hdl-6-c Datasheet
hys64d32020hdl-6-c
Related parts for hys64d32020hdl-6-c
hys64d32020hdl-6-c Summary of contents
Page 1
... – 6 – C 200 Small Outli ne Dual -In- Line Memor y Modules ...
Page 2
Edition 2003-08 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany Infineon Technologies AG 2003. © All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of ...
Page 3
... – 6 – C 200 Small Outli ne Dual -In- Line Memor y Modules ...
Page 4
HYS64D[32020/16000]HDL–6–C, , Revision History: Rev. 0.5 Previous Version: Page Subjects (major changes since last revision) We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us ...
Page 5
... Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.2 Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.3 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules 5 Rev. 0.5, 2003-08 ...
Page 6
... Small Outline Dual-In-Line Memory Modules SO-DIMM 1 Overview 1.1 Features • Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules • One rank 16M 64 and two ranks 32M 64 organization • JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM) • Single +2 0.2 V) power supply • ...
Page 7
... Compliance Code PC2700 (CL=2.5) HYS64D16000HDL–6–C PC2700S–2533–0–C1 HYS64D32020HDL–6–C PC2700S–2533–0–A1 Notes 1. All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. ...
Page 8
... Input; O: Output; I/O: bidirectional In-/Output; AI: Analog Input; PWR: Power Supply; GND: Signal Ground; NC: Not Connected; NU: Not Usable 2) CKE1 and S1 are used on two bank modules only Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Function Address Inputs Bank Address ...
Page 9
... SS 53 DQ19 54 DQ23 55 DQ24 56 DQ28 DQ25 60 DQ29 61 DQS3 62 DM3 Data Sheet Small Outline DDR SDRAM Modules Front side Back side Pin # Symbol Pin # Symbol 65 DQ26 66 DQ30 67 DQ27 68 DQ31 (CB0) 72 (CB4) 73 (CB1) 74 (CB5) 75 ...
Page 10
... Table 4 Density Organization Memory Ranks 128MB 16M 64 1 256MB 32M 64 2 Figure 1 Pin Configuration Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules SDRAMs # row/bank/ SDRAMs columns bits 16M 16 4 13/2/9 16M 16 8 13/2/9 front side back side 10 Pin Configuration Refresh ...
Page 11
... BA0-BA1 A0-AN RAS CAS WE CKE0 CKE1 V SPD DD V REF Figure 2 Block Diagram - One Rank 16M Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules s LDQS DQS4 LDM DM4 DQ32 I/O 0 DQ33 I/O 1 DQ34 I/O 2 DQ35 I/O 3 DQ36 I/O 4 DQ37 I/O 5 DQ38 I/O 6 DQ39 I/O 7 DQS5 UDQS ...
Page 12
... Note: DQ wiring may differ from that described in this drawing; however DQ/DM/DQS relationships are maintained as shown strap connections: V and Strap out (open DDR SDRAM SO-DIMM HYS64D32020HDL-6-C 12 HYS64D[32020/16000]HDL–6–C Pin Configuration Serial Presence Detect (SPD) SCL SA0 A0 ...
Page 13
... Input High (Logic1) Voltage IH(DC) V Input Low (Logic0) Voltage IL(DC) V Input Voltage Level, IN(DC) CK and CK Inputs V Input Differential Voltage, ID(DC) CK and CK Inputs VI-Matching Pull-up VI Ratio Current to Pull-down Current Data Sheet Small Outline DDR SDRAM Modules Symbol min –0.5 IN OUT V – – –1 ...
Page 14
... V. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. 6) Inputs are not recognized as valid until 7) Values are shown per DDR SDRAM component Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Values Min. Typ. Max. –2 2 – ...
Page 15
... for DDR266(A for DDR333 and DDR400B Auto-Refresh Current burst refresh RC RFCMIN Self-Refresh Current CKE 0.2 V; external clock on Operating Current 7 four bank interleaving with Burst Length = 4; see component data sheet. Data Sheet Small Outline DDR SDRAM Modules V IL,MAX V ; IH,MIN for DQ, DQS and DM ...
Page 16
... DQ I currents are not included in the calculations (see note 1) DDQ 5) The module I values are calculated from the corrponent DDx Data Sheet Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 typ. max. ...
Page 17
... Address and control input setup time Address and control input hold time Read preamble Read postamble Active to Precharge command Active to Active/Auto-refresh command period Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Electrical Characteristics Symbol –6 Unit Note/ Test DDR333 Min. Max. ...
Page 18
... V ns, measured between and OH(ac) 11) For each of the terms, if not already an integer, round to the next highest integer. cycle time. 12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. Data Sheet Small Outline DDR SDRAM Modules Symbol t RFC t RCD t RP ...
Page 19
... Module Density per Rank 32 tAS, tCS [ns] 33 tAH, TCH [ns] 34 tDS [ns] Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 HEX HEX ...
Page 20
... Part Number, Char 14 87 Part Number, Char 15 88 Part Number, Char 16 89 Part Number, Char 17 Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 HEX HEX 45 45 ...
Page 21
... Test Program Revision Code 93 Module Manufacturing Date Year Module Manufacturing Date Week 99 - 127 not used Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 HEX HEX ...
Page 22
... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 4 Package Outlines – Raw Card C DDR-SDRAM SO-DIMM HYS64D16000HDL-6-C Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules 67.6 63.6 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) 200 0.45 ±0.03 22 Package Outlines 2.4 MAX. 1 ±0.1 0.15 L-DIM-200-011 ...
Page 23
... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 5 Package Outlines – Raw Card A DDR SDRAM SO-DIMM HYS64D32020HDL-6-C Data Sheet Small Outline DDR SDRAM Modules 67.6 63.6 ±0.1 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) 200 0.45 ±0.03 23 HYS64D[32020/16000]HDL–6–C Package Outlines 3.8 MAX. ...
Page 24
Published by Infineon Technologies AG ...