k4t1g084qc Samsung Semiconductor, Inc., k4t1g084qc Datasheet - Page 7

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k4t1g084qc

Manufacturer Part Number
k4t1g084qc
Description
1gb C-die Ddr2 Sdram Specification
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
K4T1G044QC
K4T1G084QC
MOLDING AREA
(Post reflow 0.50 ± 0.05
60 - ∅0.45 Solder ball
(Datum B)
(Datum A)
0.20
#A1
M
A
B
C
D
E
G
H
K
F
J
L
3.3 FBGA Package Dimension(x4/x8)
A B
0.80
9
(0.95)
8 7 6 5 4 3 2 1
11.00 ± 0.10
11.00 ± 0.10
0.80x8=6.40
(1.90)
1.60
3.20
7 of 26
A
#A1 MARK
B
1.10 ± 0.10
0.35 ± 0.05
DDR2 SDRAM
Rev. 1.1 June 2007

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