uaa3592 NXP Semiconductors, uaa3592 Datasheet
uaa3592
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uaa3592 Summary of contents
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... DATA SHEET UAA3592 Wideband code division multiple access frequency division duplex power amplifier Objective specification INTEGRATED CIRCUITS 2002 Jul 02 ...
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... NAME UAA3592HN HVQFN16 2002 Jul 02 GENERAL DESCRIPTION The UAA3592 is a Wideband Code Division Multiple Access (WCDMA) silicon bipolar transistor Monolithic Microwave Integrated Circuit (MMIC) Power Amplifier (PA). The circuit is specially designed to operate at a nominal 3.6 V battery supply voltage. It includes a current saving architecture at low output power levels. ...
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... BLOCK DIAGRAM Die pad must be connected to ground. 2002 Jul 6,7 8 UAA3592HN 3 RFI 16 R ext BIAS POWER CONTROL DETECTOR 2 ICTL reg V detect GND Fig.1 Block diagram. 3 Objective specification 10,11 RFO 4, 5 n. FCA234 UAA3592 ...
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... RFI 3 UAA3592HN ICTL Fig.2 Pin configuration (bottom view). 4 Objective specification DESCRIPTION 9 n.c. 10 RFO 11 RFO 12 n.c. FCA235 UAA3592 ...
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... FUNCTIONAL DESCRIPTION Operating conditions The UAA3592 is designed to meet the “Third Generation Partnership Project (3GPP) specification” for the Universal Mobile Telecommunication System (UMTS) standard. Power amplifier The device is intended for WCDMA power amplification. The control signals select the bias current as given in Table 1. ...
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... B = 3.84 MHz MHz from carrier frequency +70 C; amb f = 1.5 to 2.5 GHz MHz 1920 to 1980 MHz 24.5 dBm; pin ICTL o is LOW 6 Objective specification UAA3592 MIN. TYP. MAX. 3.25 3.6 4.5 2.6 2 1.1 1.5 = 24.5 dBm 2 ext MIN. TYP. MAX. ...
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... 1 2.5 scale (1) ( 4.05 2.25 4.05 2.25 0.65 1.95 3.95 1.95 3.95 1.95 REFERENCES JEDEC JEITA MO-220 - - - 7 Objective specification detail 0.75 1.95 0.1 0.05 0.05 0.1 0.35 EUROPEAN PROJECTION UAA3592 SOT629 ISSUE DATE 01-06-28 01-08-08 ...
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... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 8 Objective specification UAA3592 ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 Jul 02 SOLDERING METHOD WAVE not suitable (2) not suitable suitable (3)(4) not recommended (5) not recommended 9 Objective specification UAA3592 (1) REFLOW suitable suitable suitable suitable suitable ...
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... Objective specification UAA3592 DEFINITIONS These products are not Philips Semiconductors ...
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... Philips Semiconductors Wideband code division multiple access frequency division duplex power amplifier 2002 Jul 02 NOTES 11 Objective specification UAA3592 ...
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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited ...