MC74HC1G00DTT1G ON Semiconductor, MC74HC1G00DTT1G Datasheet - Page 6

IC GATE NAND SGL 2INPUT SOT23-5

MC74HC1G00DTT1G

Manufacturer Part Number
MC74HC1G00DTT1G
Description
IC GATE NAND SGL 2INPUT SOT23-5
Manufacturer
ON Semiconductor
Series
74HCr
Datasheet

Specifications of MC74HC1G00DTT1G

Logic Type
NAND Gate
Number Of Inputs
2
Number Of Circuits
1
Current - Output High, Low
2.6mA, 2.6mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TSOT-23-5, TSOT-5, TSOP-5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HC1G00DTT1GOS
MC74HC1G00DTT1GOS
MC74HC1G00DTT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC74HC1G00DTT1G
Quantity:
27 000
Part Number:
MC74HC1G00DTT1G
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.05 (0.002)
S
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
H
1
D
5
L
A
2
G
4
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
B
C
0.039
1.0
0.037
0.95
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
SOLDERING FOOTPRINT*
SOT23−5/TSOP−5/SC59−5
5−LEAD PACKAGE
http://onsemi.com
MC74HC1G00
CASE 483−02
K
DT SUFFIX
ISSUE C
0.074
1.9
0.028
J
6
0.7
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. A AND B DIMENSIONS DO NOT INCLUDE
inches
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
mm
DIM
A
B
C
D
G
H
K
M
J
L
S
0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
0
_
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0.100
MAX
3.10
1.70
1.10
0.50
1.05
0.26
0.60
1.55
10
3.00
_
0.0512
0.0354
0.0098
0.0335
0.0005
0.0040
0.0079
0.0493
0.0985
0.1142
MIN
INCHES
0
_
MC74HC1G00/D
MAX
0.1220
0.0669
0.0433
0.0197
0.0413
0.0040
0.0102
0.0236
0.0610
0.1181
10
_

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