s71ws256n Meet Spansion Inc., s71ws256n Datasheet - Page 12

• Manufacturer Part Number: s71ws256n
• Description: Stacked Multi-chip Product Mcp
• Manufacturer: Meet Spansion Inc.

10
5.3.4
FEA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 9.0 x 1.4 mm
Note:
BSC is an ANSI standard for Basic Space Centering.
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
Ø b
MD
ME
A1
A2
D1
E1
eE
eD
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
H1,H10,J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
0.10
1.11
0.35
MIN
84X
---
A2,A3,A4,A5,A6,A7,A8,A9
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
12.00 mm x 9.00 mm
0.15
0.08
INDEX MARK
12.00 BSC.
PACKAGE
6
9.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
FEA 084
b
M
M
NOM
0.40
N/A
10
12
10
84
---
---
---
C A B
C
D a t a
SIDE VIEW
TOP VIEW
MAX
1.40
1.26
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S71WS-N
NOTE
( A d v a n c e
C
0.15
(2X)
A
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
eD
9
8
7
6
5
4
3
2
1
I n f o r m a t i o n )
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M L
K
SD
BOTTOM VIEW
7
J
H
G
D1
S71WS-N_00_A6 July 19, 2006
F
E
D C
B
A
SE
CORNER
PIN A1
3423 \ 16-038.21a
7
E1