ssm3k316t TOSHIBA Semiconductor CORPORATION, ssm3k316t Datasheet
ssm3k316t
Available stocks
Related parts for ssm3k316t
ssm3k316t Summary of contents
Page 1
... 2 4.7 Ω off = − 4 DSF SSM3K316T JEDEC ― JEITA ― TOSHIBA 2-3S1A Weight (typ Min Typ. Max ⎯ 30 ⎯ 18 ⎯ ⎯ ⎯ ⎯ ⎯ 0.4 1 ...
Page 2
... Usage Considerations Let V be the voltage applied between gate and source that causes the drain current (I th SSM3K316T). Then, for normal switching operation This relationship can be expressed as: V th. Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge ...
Page 3
... Gate–source voltage V 200 Common Source Ta = 25°C 150 100 1.0 0.5 Common source −50 150 Ambient temperature Ta (°C) 3 SSM3K316T I – °C − 25 °C 1.0 2.0 ( – (ON) D 1.8 V 2 VGS = ...
Page 4
... Drain–source voltage V 1000 t off C iss 100 oss C rss 100 0. SSM3K316T I – =100 °C 25 °C −25 °C –0.4 –0.6 –0.8 –1.0 ( – Common Source 2 25° ...
Page 5
... Pulse width t (s) w 1000 800 a 600 b 400 200 ) 0 -40 -20 100 1000 Ambient temperature T 5 SSM3K316T P – Mounted on FR4 board (25.4mm × 25.4mm × 1.6mm , 2 Cu Pad : 645 Mounted on FR4 board (25.4mm × 25.4mm × 1.6mm , 2 Cu Pad : 0.8 mm × ...
Page 6
... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 SSM3K316T 20070701-EN GENERAL 2008-10-20 ...