wm9090 Wolfson Microelectronics plc, wm9090 Datasheet - Page 77

• Manufacturer Part Number: wm9090
• Description: Ultra Low Power Audio Subsystem
• Manufacturer: Wolfson Microelectronics plc

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NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
Pre-Production
PACKAGE DIMENSIONS
Symbols
2
B: 20 BALL W-CSP PACKAGE 2.530
g
DETAIL 2
D1
E1
A1
A2
f2
f1
D
E
h
e
g
A
A2
A
0.615
0.361
2.500
2.040
0.219
0.270
0.035
MIN
0.250
A
B
C
D
1
5
bbb
Z
2.000 BSC
1.500 BSC
0.500 BSC
0.314 BSC
Dimensions (mm)
Z
0.700
0.244
0.386
2.530
2.070
NOM
0.070
4
BOTTOM VIEW
A1
e
3
D1
0.785
0.269
0.411
2.560
2.100
0.105
X
MAX
2
2.070
DETAIL 2
1
X
DETAIL 1
0.7mm BODY, 0.50 mm BALL PITCH
NOTE
e
5
5
E1
4
2 X
2 X
A1
CORNER
0.10
0.10
Z
Z
TOP VIEW
f1
6
D
SOLDER BALL
h
f2
PP, January 2010, Rev 3.0
DETAIL 1
DM073.A
WM9090
E
77