l99dz80ep STMicroelectronics, l99dz80ep Datasheet

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l99dz80ep

Manufacturer Part Number
l99dz80ep
Description
Door Actuator Driver
Manufacturer
STMicroelectronics
Datasheet

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Features
September 2011
One full bridge for 6 A load (R
Two half bridges for 3 A load (R
Two half bridges for 0.5 A load
(R
One high-side driver for 5 A load
(R
One configurable high-side driver for up to
1.5 A (R
(R
One configurable high-side driver for 0.7 A
(R
load
Two high-side drivers for 0.5 A load
(R
Programmable softstart function to drive loads
with higher inrush currents as current limitation
value
Very low V
mode (I
Current monitor output for all high-side drivers
Central two-stage charge pump
Motor bridge driver with full R
Device contains temperature warning and
protection
Open-load detection for all outputs
Overcurrent protection for all outputs
Separated half bridges for door lock motor
Programmable PWM control of all outputs
STM standard serial peripheral interface (ST-
SPI 3.1)
Control block for electrochromic element
Electrochromic element can be negatively
discharged
Prepared for additional fail-safe path for
H-bridge
ON
ON
ON
ON
ON
= 1600 mΩ)
= 100 mΩ)
= 1600 mΩ) load
= 800 mΩ) or 0.35 A (R
= 1600 mΩ)
S
ON
< 6 µA typ; T
S
= 500 mΩ) or 0.35 A
current consumption in standby
j
≤ 85 °C)
ON
dson
ON
ON
= 1600 mΩ)
= 150 mΩ)
down to 6 V
= 300 mΩ)
Doc ID 18260 Rev 4
Applications
Description
The L99DZ80EP is a microcontroller driven
multifunctional door actuator driver for automotive
applications. Up to five DC motors and five
grounded resistive loads can be driven with six
half bridges and five high-side drivers. Four
external MOS transistors in bridge configuration
can be driven. An electrochromic mirror glass can
be controlled using the integrated SPI-driven
module in conjunction with an external MOS
transistor. The mirror glass can also be
discharged through a negative supply. The
integrated SPI controls all operating modes
(forward, reverse, brake and high impedance).
Also all diagnostic information is available via SPI
read.
Table 1.
Door actuator driver with 6 bridges for double
door lock control, mirror fold and mirror axis
control, high-side driver for mirror defroster,
bulbs and LEDs.
Control block with external MOS transistor for
charging / discharging of electrochromic glass.
Motor bridge driver.
H-bridge control for external power transistors
TQFP-64
Package
Device summary
Door actuator driver
L99DZ80EP
TQFP-64
Tray
L99DZ80EP
Order codes
L99DZ80EPTR
Tape and reel
www.st.com
1/68
1

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l99dz80ep Summary of contents

Page 1

... Motor bridge driver. ■ H-bridge control for external power transistors Description The L99DZ80EP is a microcontroller driven multifunctional door actuator driver for automotive applications five DC motors and five grounded resistive loads can be driven with six half bridges and five high-side drivers. Four ...

Page 2

... Inductive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.9 Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.10 Overcurrent detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.11 Current monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.12 PWM mode of the power outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.13 Cross-current protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.14 Programmable soft-start function to drive loads with higher inrush current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.15 H-bridge control (DIR, PWMH, bits SD, SDS 3.16 H-bridge driver slew-rate control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2/68 TQFP-64 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 3

... L99DZ80EP 3.17 Resistive low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.18 Short circuit detection/drain source monitoring . . . . . . . . . . . . . . . . . . . . 38 3.19 H-bridge monitoring in off-mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.20 Programmable cross current protection . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.21 Controller of electrochromic glass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.22 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4 Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.1 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.1.1 4.1.2 4.1.3 4.1.4 4.1.5 4.2 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 4.2.1 4.3 Device memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 5 SPI - control and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 5.1 Control Register 5.2 Control Register ...

Page 4

... Contents 6.3 TQFP-64 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 4/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 5

... L99DZ80EP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 4. ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 5. Operating junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 6. Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 7. Package thermal impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 8. Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 9. Overvoltage and undervoltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 10. ...

Page 6

... TQFP-64 power lead-less tray shipment (no suffix) (part Figure 25. TQFP-64 power lead-less tray shipment (no suffix) (part Figure 26. TQFP-64 power lead-less tape and reel shipment (suffix “TR”) (part 1 Figure 27. TQFP-64 power lead-less tape and reel shipment (suffix “TR”) (part 2 6/68 Doc ID 18260 Rev 4 L99DZ80EP detected ...

Page 7

... L99DZ80EP 1 Block diagram and pin description Figure 1. Block diagram Block diagram and pin description Doc ID 18260 Rev 4 7/68 ...

Page 8

... The data bit control word and the most significant bit (MSB, bit 23) is transferred first. Serial clock input: this input controls the internal shift register of the SPI and requires CMOS logic levels. Direction Input: this input controls the H-Bridge Drivers Doc ID 18260 Rev 4 L99DZ80EP Function ...

Page 9

... L99DZ80EP Table 2. Pin definitions and functions (continued) Pin Symbol 39 VCC 44 OUT9 42 PWMH 43 ECDR 62, 63 OUT7 61 OUT8 47 OUT10/EC 54 ECFD 53 ECV 13 GH2 14 SH2 15 GL2 16 SL2 64 GH1 1 SH1 4 GL1 5 SL1 7 CP1P 8 CP1M 9 CP2P 10 CP2M 6 CP Block diagram and pin description Function Supply Voltage supply. A ceramic capacitor as close as possible to GND is recommended ...

Page 10

... Block diagram and pin description Figure 2. Pin connection (top view) 10/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 11

... L99DZ80EP 2 Electrical specifications 2.1 Absolute maximum ratings Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied ...

Page 12

... Thermal warning / shutdown T jtft filter time Table 7. Package thermal impedance Symbol R Thermal resistance junction to ambient (max) thj-amb 12/68 Parameter Parameter Parameter Test condition Parameter Doc ID 18260 Rev 4 L99DZ80EP Value Unit (1) ±2 kV (1) ±4 kV Value Unit -40 to 150 °C Min. Typ. Max. Unit 130 150 ° ...

Page 13

... L99DZ80EP 2.4 Package and PCB thermal data 2.4.1 TQFP-64 thermal data Figure 3. TQFP-64 2 layer PCB Figure 4. TQFP-64 4 layer PCB Note: Layout condition of R board double layer and four layers, board dimension 77 mm x114 mm, board material FR4, Cu thickness 0.070mm (outer layers), Cu thickness 0.035mm (inner layers), thermal vias separation 1 ...

Page 14

... Electrical specifications Figure 5. TQFP-64 thermal impedance junction to ambient vs PCB copper area 14/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 15

... L99DZ80EP 2.5 Electrical characteristics The voltages are referred to ground and currents are assumed positive, when the current flows into the pin ≤ -40 °C to 150 °C, unless otherwise specified. j Table 8. Supply Symbol V Operating voltage range S Current consumption in I VS(act) active mode ...

Page 16

... OUT.min I = 0.4A; OUT2,3,9,10max I = 0.3 A; OUT7max I = 0.6 A; OUT8(low rdson)max I = 0.3 A OUT8(high rdson)max Test condition - ≥ - Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max. 48 5.8 5.5 0.1 VCCRESHD 3.4 3.1 0.3 PORONL Min. Typ. Max 1/10000 1/6500 1/2000 ...

Page 17

... L99DZ80EP Table 11. Charge pump (continued) Symbol Parameter Charge pump output I CP (1) current Charge pump output I CPlim current limitation Charge pump low V CP_low threshold voltage Charge pump low filter T CP time the minimum current the device can provide to an external circuit without ...

Page 18

... 0.5 V; OUT S active mode standby mode OUT active mode OUT Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max. Unit = +25 °C; amb 800 1200 mΩ = +125 °C; amb 1200 1700 mΩ = +25 °C; amb 1600 2400 mΩ = +125 °C; amb 2500 3400 mΩ ...

Page 19

... L99DZ80EP Table 13. Power outputs switching times Symbol Output delay time high side driver on (all OUT except OUT Output delay time high side t driver on (OUT mode) Output delay time high side driver on (OUT mode) Output delay time high side driver off (OUT ...

Page 20

... source sink Duration of overcurrent condition to set the status bit sink and source source Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max. Unit 1.5 2.5 A 0.35 0.65 A 0.7 1.3 A 0.35 0.65 A 0.5 1 7.5 A 0.5 1 100 µ kHz ...

Page 21

... L99DZ80EP Table 14. Current monitoring (continued) Symbol |I | Undercurrent threshold to GND OLDECV t Filter time of open-load signal FOL 2.7 H-bridge driver Table 15. Gate drivers for the external Power-MOS (H-bridge) Symbol Average charge current I GHx(Ch) (charge stage) On-resistance (discharge- R GHx stage) V Gate-on voltage GHxH Passive gate-clamp ...

Page 22

... 13 Ω 13 Ω 13 ( Ω PWMH - duty cycle = 50 % CCP Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max SHx 24 SHx 18 SHx See Figure SHx Figure 7 See 1 1.5 ...

Page 23

... L99DZ80EP Figure 6. IGHxr ranges Figure 7. IGHxf ranges Doc ID 18260 Rev 4 Electrical specifications 23/68 ...

Page 24

... Drain-source threshold voltage SCd4 t Drain-source monitor filter time SCd Drain-source comparator t scs settling time 24/68 Parameter Test condition from GND to V Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max. 0.3 0.5 0.7 0.8 1 1.2 1.2 1.5 1.8 1.6 2 2 jump SH — Unit µ ...

Page 25

... L99DZ80EP Table 18. Open-load monitoring Symbol Parameter Low-side drain-source monitor low V ODSL off-threshold voltage Low-side drain-source monitor V ODSH high off-threshold voltage Output voltage of selected SHx in V OLSHx open-load test mode Pull-down resistance of the non- R selected SHx pin in open-load pdOL mode T Open-load filter time OL 2 ...

Page 26

... Test condition ( ECFD target below it toggle status bit ECV_VNR = ’1‘ ( ECFD target above it Toggle status bit ECV_VH = ‘1’I can change sign ECDR Figure 20 , Figure 21 ). typ Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max ECFD 120 - V ; ECFD -120 Unit mV mV ...

Page 27

... L99DZ80EP 2.9 SPI / logic – electrical characteristics The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6V ≤ -40 °C to 150 °C, unless otherwise specified. j Table 20. Delay time from Standby to Active mode Symbol Parameter t Delay time ...

Page 28

... 100 pF 100 pF Doc ID 18260 Rev 4 L99DZ80EP Min. Typ. Max. — — 10 — — 10 Figure 10 Figure 11 , and . Min. Typ. Max. Unit = 1 mA 13.5 V; 100 mA; DO 100 ...

Page 29

... L99DZ80EP Table 23. Dynamic characteristics (continued) Symbol rise time of input signal DI, CLK, CSN fall time of input signal DI, CLK, CSN Figure 9. SPI timing parameters Parameter Test condition Doc ID 18260 Rev 4 Electrical specifications Min. Typ. Max. Unit ...

Page 30

... Electrical specifications Figure 10. SPI input and output timing parameters Figure 11. SPI delay description 30/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 31

... L99DZ80EP Table 24. Watchdog Symbol TC Watchdog time out WDTO Figure 12. Power-output (OUT<11:1>, ECV, ECFD) timing Parameter Test condition Doc ID 18260 Rev 4 Electrical specifications Min. Typ. Max. Unit 50 64 100 ms 31/68 ...

Page 32

... S supply the control and status information are not lost, if there CC and V the device operates in standby-mode. Pulling the signal CSN S CC rises above the overvoltage threshold V S Doc ID 18260 Rev 4 L99DZ80EP . less than the power-MOS outputs, the EC the outputs ...

Page 33

... L99DZ80EP pump is disabled and the H-Bridge gate drivers are switched into sink condition to protect the H-bridge and the load. When the voltage V V (UV-switch-OFF voltage), the output stages are switched to high impedance to SUV_OFF avoid the operation of the power devices without sufficient gate driving voltage (increased power dissipation) ...

Page 34

... LSB = 100/128 %. Which output uses which corresponding PWM driver can be seen in the SPI register definition. When programming a specific duty-cycle, the output on/off times as well as the slopes must be taken into account. 34/68 , the overcurrent flag is set and the corresponding driver is FOC Doc ID 18260 Rev 4 L99DZ80EP the corresponding open- FOL ...

Page 35

... L99DZ80EP 3.13 Cross-current protection The six half-brides of the device are crosscurrent protected by an internal delay time. If one driver (LS or HS) is turned off, the activation of the other driver of the same half bridge is automatically delayed by the crosscurrent protection time. After the crosscurrent protection time is expired the slew-rate limited switch-off phase of the driver is changed to a fast turn- off phase and the opposite driver is turned-on with slew-rate limitation ...

Page 36

... Doc ID 18260 Rev 4 L99DZ80EP Comment RL RL H-bridge disabled RL RL Charge pump voltage too low RL RL Thermo-shutdown L L Overvoltage (1) (1) ( Short-circuit H L Bridge H2/L1 on Slow-decay mode LS1 and LS2 ...

Page 37

... L99DZ80EP Table 25. H-bridge control truth table (continued) Control pins Control bits N° DIR PWMH HEN SD SDS CP_LOW TSD GH1 GL1 GH2 GL2 Only the half-bridge (low and high-side), in which one MOSFET is in short circuit condition is switched off. Both MOSFETs of the other half-bridge remain active and driven by DIR and PWMH 3 ...

Page 38

... Resistive low The resistive output mode protects the L99DZ80EP and the H-bridge in the standby mode and in some failure modes (thermal shut down (TSD), charge pump low (CP_LOW) and stuck-at-‘1’ at pin DI). When a gate driver changes into the resistive output mode due to a failure a sequence is started. In this sequence the concerning driver is switched into sink condition for 32 µ ...

Page 39

... L99DZ80EP to be cleared through the SPI to reactivate the gate drivers. The drain source monitoring has a filter time of typ. 6 µs. This monitoring is only active while the corresponding gate driver is activated drain-source monitor event is detected, the corresponding gate-driver remains activated for at maximum the filter time. When the gate driver switches on, the drain-source comparator requires the specified settling time until the drain-source monitoring is valid ...

Page 40

... HIGH)” bit to one. Figure 16. H-bridge open-load detection (no open-load detected) Figure 17. H-bridge open-load detection (open-load detected) 40/68 on the pull-up high-side and 1 can be diagnosed by setting the “H-Bridge OL high threshold (H-OLTH Doc ID 18260 Rev 4 on the low side the drain-source monitor bit of the L99DZ80EP ...

Page 41

... L99DZ80EP Figure 18. H-bridge open-load detection (short to ground detected) Figure 19. H-bridge open-load detection with H-OLTH HIGH = ‘1’ (short to V detected) 3.20 Programmable cross current protection Both external MOSFET transistors in one half-bridge are disabled for the cross-current protection time (t CCP current flowing from the high-side to the low-side MOSFET. ...

Page 42

... ECVhi /ECV – filter time and are not latched. NR Figure 20 for details). L99DZ80EP unit ...

Page 43

... L99DZ80EP If the electrochrome element is connected between the pins ECV and ECFD instead between ECV and ground, a negative voltage can be applied to the device by pulling ECFD to a higher value than ECV, which is connected to ground by a 1.6 Ω low-side switch. In this mode the voltage at pin ECFD is controlled to the target value defined by the register EC< ...

Page 44

... If no watchdog bit inversion has been occurred during the watchdog time-out time T into resistive-low condition, all power outputs are switched off, the electrochrome driver is disabled and the device enters standby mode. 44/68 WDTO Doc ID 18260 Rev 4 L99DZ80EP the H-bridge drivers switch ...

Page 45

... L99DZ80EP 4 Functional description of the SPI 4.1 General description The SPI complies with Standard ST-SPI Interface Version 3.1. Its communication is based on a Serial Peripheral Interface structure using CSN (Chip Select Not), DI (Serial Data In), DO (Serial Data Out/Error) and CLK (Serial Clock) signal lines. 4.1.1 Chip Select Not (CSN) The CSN input pin is used to select the serial interface of this device ...

Page 46

... The data returned on DO within the same frame always starts with the <Global Status> Byte. It provides general status information about the device followed by two data bytes (i. e. ‘In-frame-response’). For write cycles the <Global Status> Byte is followed by the previous content of the addressed register. Figure 22. Write and read SPI 46/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 47

... L99DZ80EP 4.2 Command byte Table 28. Command byte Command byte Bit Name OC1 OC0 D15 D14 D13 D12 D11 D10 OCx: operation code Ax: address Dx: data bit Each communication frame starts with a command byte. It consists of an operating code which specifies the type of operation (< ...

Page 48

... Read/clear diagnosis Read/clear V and chargepump diagnosis S Read/write Mask bits in global status register Name Access Read only Read only Read only Read only Read only Doc ID 18260 Rev 4 L99DZ80EP Content Content 4300h (ASSP ST_SPI) 0300h 5200h (82 ST_SPI) 4800h (H ST_SPI) 4200h SPI-Frame-ID (ST_SPI) ...

Page 49

... L99DZ80EP 5 SPI - control and status registers Table 32. Global status byte Bit 7 6 Name GL_ER CO_ER Reset 0 0 GL_ER: Global Error Flag. Failures of bits are always linked to the Global Error Flag. This flag is set least one of these bits indicates a failure reflected via the DO pin while CSN is held low and no SPI clock signal is applied. This operation does not cause the Communication Error bit in the < ...

Page 50

... The corresponding output driver is activated, if this bit is set. 0 Setting the PWM enable bit, the driver is only switched on the PWM timer enables it. 0 Doc ID 18260 Rev 4 L99DZ80EP Content Content Mode Off Low on-resistance High on-resistance Off ...

Page 51

... L99DZ80EP Table 34. Control Register 1 (continued) Bit Name Access 7 EC<5> Read/write 6 EC<4> Read/write 5 EC<3> Read/write 4 EC<2> Read/write 3 EC<1> Read/write 2 EC<0> Read/write 1 ECON Read/write 0 ECFD_LS on/off Read/write 5.3 Control Register 2 Table 35. Control Register 2 Bit Name Access 15 OUT1_OCR Read/write 14 OUT2_OCR Read/write 13 OUT3_OCR Read/write 12 OUT4_OCR Read/write 11 OUT5_OCR Read/write 10 OUT6_OCR Read/write 9 ECV_OCR Read/write ...

Page 52

... CM_SEL<3:0> 0 0000 0001 0010 0011 0 0100 0101 0110 0111 1000 1001 0 1010 1011 1100 1101-1111 Doc ID 18260 Rev 4 L99DZ80EP Content Selected output 3-state OUT<1> OUT<2> OUT<3> OUT<4> OUT<5> OUT<6> OUT<7> OUT<8> OUT<9> OUT<10> OUT<11> Reserved 3-state ...

Page 53

... L99DZ80EP 5.5 Control Register 4 Table 37. Control Register 4 Bit Name Access 15 SLEW<4> Read/write 14 SLEW<3> Read/write 13 SLEW<2> Read/write 12 SLEW<1> Read/write 11 SLEW<0> Read/write 10 H-OLTH HIGH Read/write 9 OL_H1L2 Read/write 8 OL_H2L1 Read/write 7 SD Read/write 6 SDS Read/write 5 COPT<3> Read/write 4 COPT<2> Read/write 3 COPT<1> Read/write 2 COPT<0> Read/write 1 DIAG<1> Read/write 0 DIAG<0> ...

Page 54

... Read/write 54/68 Reset Binary coded PWM1 on-duty-cycle Reset 0 Reserved (must be set to ‘0’ Binary coded PWM4 on-duty-cycle Reserved (must be set to ‘0’ Binary coded PWM3 on-duty-cycle Doc ID 18260 Rev 4 L99DZ80EP Content Content ...

Page 55

... L99DZ80EP 5.8 Configuration Register Table 40. Configuration Register Bit Name Access HEN Read/write 5 MASK OL HS1 Read/write 4 MASK OL LS1 Read/write 3 MASK TW Read/write 2 MASK EC OL Read/write 1 MASK OL Read/write 0 WD Read/write 5.9 Status Register 0 Table 41. Status Register 0 Bit ...

Page 56

... Read 1 0 Read 0 0 Read 56/68 Content DS-Monitoring bit. A ‘1’ indicates that a drain-monitoring event (short- circuit or open-load) has occurred. Content Open-Load status bit of the corresponding output driver. A ‘1’ indicates that an open-load event has occurred. Reserved Doc ID 18260 Rev 4 L99DZ80EP ...

Page 57

... L99DZ80EP 5.11 Status Register 2 Table 43. Status Register 2 Bit Name Access 15 OUT7 OC Read/clear 14 OUT7 OL Read/clear 13 OUT8 OC Read/clear 12 OUT8 OL Read/clear 11 OUT9 OC Read/clear 10 OUT9 OL Read/clear 9 OUT10 OC Read/clear 8 OUT10 OL Read/clear 7 OUT11 OC Read/clear 6 OUT11 OL Read/clear 5 ECV OC Read/clear 4 ECV OL Read/clear Read/clear Read/clear 1 ECV_VNR Read/clear 0 ECV_VHI Read/clear 5 ...

Page 58

... Bit Name Access 5 ECFDH OC Read/clear 4 ECFDH OL Read/clear 3 ECFD OC Read/clear 2 ECFD OL Read/clear 1 0 Read 0 CP LOW Read/clear 58/68 Overcurrent and open-load status bit of the corresponding output driver Reserved This bit indicates, that the charge pump voltage is too low Doc ID 18260 Rev 4 L99DZ80EP Content ...

Page 59

... L99DZ80EP 6 Package and packing information ® 6.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 6.2 TQFP-64 mechanical data Table 45 ...

Page 60

... Package and packing information Figure 23. TQFP-64 package dimension 60/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 61

... L99DZ80EP 6.3 TQFP-64 packing information The devices can be packed in tray or tape and reel shipments (see the summary on page 1 Figure 24. TQFP-64 power lead-less tray shipment (no suffix) (part 1) for packaging quantities). Doc ID 18260 Rev 4 Package and packing information Figure 1: Device 61/68 ...

Page 62

... Package and packing information Figure 25. TQFP-64 power lead-less tray shipment (no suffix) (part 2) 62/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 63

... L99DZ80EP Figure 26. TQFP-64 power lead-less tape and reel shipment (suffix “TR”) (part 1) Package and packing information Doc ID 18260 Rev 4 63/68 ...

Page 64

... Package and packing information Figure 27. TQFP-64 power lead-less tape and reel shipment (suffix “TR”) (part 2) 64/68 Doc ID 18260 Rev 4 L99DZ80EP ...

Page 65

... L99DZ80EP 7 Revision history Table 46. Document revision history Date Revision 20-Dec-2010 10-Mar-2011 1 Initial release Updated Features list. Updated following tables: – Table 1: Device summary – Table 2: Pin definitions and functions GH2, SH2, GL2, SL2: updated functions – Table 7: Package thermal impedance – ...

Page 66

... ODSH Table 19: Electrochrome mirror driver – DNL , DNL : added note ECV ECFD Table 20: Delay time from Standby to Active mode – updated max value set Doc ID 18260 Rev 4 L99DZ80EP Change from 5 5 updated max value : 7 ...

Page 67

... L99DZ80EP Table 46. Document revision history (continued) Date Revision 16-Sep-2011 Table 1: Device summary Updated Table 9: Overvoltage and undervoltage detection – updated min value SUV OFF Table 11: Charge pump – updated test condition and max value CP – updated max value CP – updated min value ...

Page 68

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 68/68 Please Read Carefully: © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 18260 Rev 4 L99DZ80EP ...

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