tza3054a NXP Semiconductors, tza3054a Datasheet - Page 11

• Manufacturer Part Number: tza3054a
• Description: 100 Mbits/s To 3.2 Gbits/s A-rate Tm Limiting Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9397 750 13466
Objective data sheet
8.5.2.1 Junction temperature
8.5.2.2 Supply voltage
8.5.2.3 LLD voltage
8.5.2.4 External voltage
8.5.2 Diagnostic support
8.5.3 Power supply connections
The TZA3054A supports several diagnostic functions, including:
The junction temperature, supply voltage, LLD voltage and an external voltage (EXT
input) can be measured with a built-in 8-bit ADC, based on the successive approximation
principle. The value of the measured quantity can then be read in the appropriate ADC
result register. A supervisory algorithm can be implemented in a microcontroller, to realize
the required diagnostic functionality e.g. the i-SFP standard, SFF-8472.
The junction temperature can be measured in a range of 40 C to +85 C with
approximately 3 C resolution. The result can be read from ADC register 08h. The
following formula can be applied to convert the ADC reading into a temperature:
T = 478.43
The supply voltage can be measured in a range of 2.4 V to 3.7 V with approximately 5 mV
resolution. The result can be read from ADC register 09h. The formula to convert the ADC
reading into the supply voltage is: V
The LLD voltage can be measured from 0 mV to 1200 mV with approximately 5 mV
resolution. The result can be read from ADC register 0Ah. The formula to convert the ADC
reading into the supply voltage is: V
converted to an input voltage by using
The external input voltage (EXT) can be measured between 0 V and 3.6 V with
approximately 15 mV resolution. The result can be read from ADC register 0Bh. The
formula to convert the ADC reading into the supply voltage is:
V
Two separate supply domains (V
functional blocks of the TZA3054A. Each supply domain should be connected to a
common V
die pad, must be connected. The die pad should be connected with the lowest
inductance possible. Since the die pad is also used as the main ground return of the chip,
the connection should also have a low DC impedance. The voltage supply levels should
be in accordance with the values specified in
All external components should be surface mounted devices, preferably of size 0603 or
smaller. The components must be mounted as close to the IC as possible, especially
supply decoupling capacitors.
•
•
•
•
EXT
Junction temperature
Supply voltage
Input signal strength (LLD)
External voltage (EXT input).
= 14.45
CC
2.93
via a separate filter. All supply and ground pins, including the exposed
10
3
ADC
ADC
Rev. 01 — 12 August 2004
value
value
.
.
CCI
CC
LLD
and V
100 Mbit/s to 3.2 Gbit/s A-rate
Figure
= 2.4 + 4.82
= 4.82
CCO
Section
5.
) provide isolation between the various
10
3
10
11.
ADC
3
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
value
ADC
. The LLD voltage can be
value
TZA3054A
.
limiting amplifier
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