cp2400-c-gdi Silicon Laboratories, cp2400-c-gdi Datasheet - Page 8

• Manufacturer Part Number: cp2400-c-gdi
• Description: Tested 128 Segment Lcd Driver Die In Wafer Form
• Manufacturer: Silicon Laboratories

CP2400-C-GDI
8
*Note: Pins marked “Reserved” should not be connected.
Physical Pad
Number
Table 3.1. SPI Bonding Pad Coordinates (Relative to Center of Die) (Continued)
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Example Package
Pin Number
Reserved*
Reserved*
Reserved*
Reserved*
(QFN-48)
GND
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
Package Pin Name
P1.7/LCD15
P1.6/LCD14
P1.5/LCD13
P1.4/LCD12
P1.2/LCD10
P1.3/LCD11
P1.1/LCD9
P1.0/LCD8
P0.7/LCD7
P0.6/LCD6
P0.5/LCD5
P0.4/LCD4
P0.3/LCD3
P0.2/LCD2
P0.1/LCD1
P0.0/LCD0
MISO
MOSI
Rev. 1.0
GND
SCK
NSS
RST
CLK
INT
—
—
—
—
Physical Pad X
–135.13
–210.13
–285.13
–360.13
–435.13
–510.12
134.87
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
858.75
509.87
434.87
359.87
284.87
209.87
–60.13
14.87
(µm)
Physical Pad Y
–515.09
–440.09
–365.09
–290.09
–215.09
–140.09
–65.09
129.91
204.91
279.91
354.91
429.91
504.91
54.91
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
739.5
(µm)