cp2400-c-gdi Silicon Laboratories, cp2400-c-gdi Datasheet - Page 7

• Manufacturer Part Number: cp2400-c-gdi
• Description: Tested 128 Segment Lcd Driver Die In Wafer Form
• Manufacturer: Silicon Laboratories

3. Bonding Information
3.1. SPI Bonding Information
*Note: Pins marked “Reserved” should not be connected.
Physical Pad
Number
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
11
1
2
3
4
5
6
7
8
9
Table 3.1. SPI Bonding Pad Coordinates (Relative to Center of Die)
Example Package
Pin Number
Reserved*
Reserved*
Reserved*
(QFN-48)
48
10
12
13
14
15
16
17
18
19
20
21
22
23
24
11
1
2
3
4
4
5
6
7
8
9
Package Pin Name
P3.7/LCD31
P3.6/LCD30
P3.5/LCD29
P3.4/LCD28
P3.3/LCD27
P3.2/LCD26
P3.1/LCD25
P3.0/LCD24
P2.7/LCD23
P2.6/LCD22
P2.5/LCD21
P2.4/LCD20
P2.3/LCD19
P2.2/LCD18
P2.1/LCD17
P2.0/LCD16
P4.3/COM3
P4.2/COM2
P4.1/COM1
P4.0/COM0
XTAL1
XTAL2
Rev. 1.0
GND
GND
CAP
VDD
—
—
—
Physical Pad X
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–858.75
–508.49
–433.49
–358.49
–283.49
–208.49
–133.49
–58.49
136.51
211.51
286.51
361.51
436.51
511.51
61.51
(µm)
CP2400-C-GDI
Physical Pad Y
–174.59
–249.59
–324.59
–399.59
–474.59
–549.59
545.41
470.41
395.41
320.41
245.41
170.41
–24.59
–99.59
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
–739.5
50.41
(µm)
7