mpc5534mzq66 Freescale Semiconductor, Inc, mpc5534mzq66 Datasheet - Page 5

• Manufacturer Part Number: mpc5534mzq66
• Description: Mpc5534 High Performance Microcontroller
• Manufacturer: Freescale Semiconductor, Inc

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3.2
Freescale Semiconductor
Num
27
28
29
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or
cause permanent damage to the device.
Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum specifications for device stress have
not yet been determined.
1.5V +/– 10% for proper operation. This parameter is specified at a maximum junction temperature of 150C.
All functional non-supply I/O pins are clamped to VSS and VDDE or VDDEH.
AC signal over and undershoot of the input voltages of up to +/– 2.0 volts is permitted for a cumulative duration of 60 hours
over the complete lifetime of the device (injection current does not need to be limited for this duration).
Internal structures will hold the voltage above –1.0 volt if the injection current limit of 2 mA is met.
Internal structures will not clamp to a safe voltage. External protection must be used to ensure that voltage on the pin stays
above –0.3 volts.
Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDEH supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDEH is within Operating Voltage specifications.
Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within Operating Voltage specifications.
Total injection current for all pins (including both digital and analog) must not exceed 25mA.
Total injection current for all analog input pins must not exceed 15mA.
Lifetime operation at these specification limits is not guaranteed.
Solder profile per CDF-AEC-Q100.
Moisture sensitivity per JEDEC test method A112.
Storage Temperature Range
Maximum Solder Temperature
Moisture Sensitivity Level
Num
1
2
3
4
5
Thermal Characteristics
Junction to Ambient
Junction to Ambient
Junction to Ambient
Junction to Ambient
Junction to Board
Natural Convection
(Single layer board)
Natural Convection
(@200 ft./min.,
Single layer board)
(@200 ft./min.,
Four layer board 2s2p)
(Four layer board 2s2p)
(Four layer board 2s2p)
Characteristic
Characteristic
Table 2. Absolute Maximum Ratings
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4
1, 2
1, 3
Preliminary—Subject to Change Without Notice
13
MPC5534 Microcontroller Data Sheet, Rev. 0
Table 3. Thermal Characteristics
Symbol
R
R
R
R
R
θJMA
θJMA
θJB
θJA
θJA
Symbol
1
T
T
MSL
STG
SDR
(continued)
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
208 MAPBGA
– 55.0
Min
42
26
34
22
15
—
—
Electrical Characteristics
Value
324 PBGA
150.0
260.0
Max
3
34
23
28
20
15
2
Unit
o
o
C
C
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