74hct2g34gw NXP Semiconductors, 74hct2g34gw Datasheet

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74hct2g34gw

Manufacturer Part Number
74hct2g34gw
Description
74hc2g34; 74hct2g34 Dual Buffer Gate
Manufacturer
NXP Semiconductors
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74HCT2G34GW
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
1. General description
2. Features
3. Ordering information
Table 1.
4. Marking
Table 2.
Type number
74HC2G34GW
74HC2G34GV
74HCT2G34GW
74HCT2G34GV
Type number
74HC2G34GW
74HC2G34GV
74HCT2G34GW
74HCT2G34GV
Ordering information
Marking
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
The 74HC2G34; 74HCT2G34 is a high-speed Si-gate CMOS device.
The 74HC2G34; 74HCT2G34 provides two buffers.
I
I
I
I
I
I
I
I
I
74HC2G34; 74HCT2G34
Dual buffer gate
Rev. 01 — 6 October 2006
Wide supply voltage range from 2.0 V to 6.0 V
Complies with JEDEC standard no. 7A
High noise immunity
ESD protection:
Low power dissipation
Balanced propagation delays
Unlimited input rise and fall times
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
N
N
HBM JESD22-A114-D exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
SC-88
SC-74
SC-88
SC-74
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package (TSOP6); 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package (TSOP6); 6 leads
Marking code
PA
P34
UA
U34
Product data sheet
Version
SOT363
SOT457
SOT363
SOT457

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74hct2g34gw Summary of contents

Page 1

... C to +125 C 74HC2G34GV +125 C 74HCT2G34GW +125 C 74HCT2G34GV +125 C 4. Marking Table 2. Marking Type number 74HC2G34GW 74HC2G34GV 74HCT2G34GW 74HCT2G34GV Description SC-88 plastic surface-mounted package; 6 leads SC-74 plastic surface-mounted package (TSOP6); 6 leads SC-88 plastic surface-mounted package; 6 leads SC-74 plastic surface-mounted package (TSOP6); 6 leads Marking code PA ...

Page 2

... NXP Semiconductors 5. Functional diagram mnb063 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin 1A 1 GND 74HC_HCT2G34_1 Product data sheet 74HC2G34; 74HCT2G34 ...

Page 3

... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current ...

Page 4

... NXP Semiconductors Table 6. Recommended operating conditions Symbol Parameter Type 74HCT2G34 V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t rise time r t fall time f 10. Static characteristics Table 7. Static characteristics for 74HC2G34 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...

Page 5

... NXP Semiconductors Table 7. Static characteristics for 74HC2G34 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +85 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current ...

Page 6

... NXP Semiconductors Table 7. Static characteristics for 74HC2G34 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I supply current CC Table 8. Static characteristics for 74HCT2G34 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...

Page 7

... NXP Semiconductors Table 8. Static characteristics for 74HCT2G34 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +125 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current ...

Page 8

... NXP Semiconductors Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter 74HCT2G34 t propagation delay pd t transition time t C power dissipation PD capacitance [ the same as t and t pd PLH PHL [ the same as t and t t TLH ...

Page 9

... NXP Semiconductors GENERATOR Test data is given in Table 11. Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 6. Load circuitry for switching times Table 11. Test data Type Input V 74HC2G34 ...

Page 10

... NXP Semiconductors 13. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 7. Package outline SOT363 (SC-88) 74HC_HCT2G34_1 Product data sheet scale ...

Page 11

... NXP Semiconductors Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT 0.1 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT457 Fig 8. Package outline SOT457 (SC-74) 74HC_HCT2G34_1 Product data sheet scale ...

Page 12

... NXP Semiconductors 14. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model DUT Device Under Test 15. Revision history Table 13. Revision history Document ID Release date 74HC_HCT2G34_1 20061006 74HC_HCT2G34_1 Product data sheet 74HC2G34; 74HCT2G34 ...

Page 13

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 14

... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 14 Abbreviations ...

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