w83195bg-202 Winbond Electronics Corp America, w83195bg-202 Datasheet - Page 23

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w83195bg-202

Manufacturer Part Number
w83195bg-202
Description
Clock For Via Chipsets
Manufacturer
Winbond Electronics Corp America
Datasheet
9.5
9.6
VDDPCI= 3.3V
Rise Edge Rate
Fall Edge Rate
Cycle to Cycle jitter
Jitter Accumulated
Duty Cycle
Pull-Up Current Min
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max
VDDPCI= 3.3V
Rise Edge Rate
Fall Edge Rate
Cycle to Cycle jitter
AGP Electrical Characteristics
PCI Electrical Characteristics
V
V
CM
PARAMETER
PARAMETER
DIFF
CLOCK GEN. FOR AMD K8 SYSTEM SERIES CHIPSET
±
±
5 %, TA = 0
5 %, TA = 0
V
CM
V
DIFF
°
°
C to +70
C to +70
-1000
MIN
MIN
-33
45
30
1
1
1
1
°
°
MAX
C, Test load, Cl=10pF,
C, Test load, Cl=10pF,
250
1000
MAX
250
4
4
-33
55
38
4
4
W83195BR-202/W83195BG-202
- 19 -
UNITS
V/ns
V/ns
UNIT
V/ns
V/ns
ps
mA
mA
mA
mA
ps
ps
%
S
V
V
DIFF
CM
Measured from 20% to 60%
Measured from 20% to 60%
Measured on rising edge at 1.5V,
Maximum difference of cycle time
between two adjacent cycles.
Measured using the JIT2 software
package
Measured on rising and falling edge at
1.5V
Vout=1.0V
Vout=3.135V
Vout=1.95V
Vout=0.4V
Measured from 20% to 60%
Measured from 20% to 60%
Measured on rising edge at 1.5V,
Maximum difference of cycle time
between two adjacent cycles.
=V
=V
CM_0
DIFF_0
-V
Publication Release Date: Apr. 2006
-V
CM_1
V
TEST CONDITIONS
TEST CONDITIONS
DIFF_1
CM_0
V
DIFF_0
Revision 0.6
V
V
CM_1
DIFF_1

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