upc1652g Renesas Electronics Corporation., upc1652g Datasheet - Page 4

• Manufacturer Part Number: upc1652g
• Description: Silicon Monolithic Bipolar Integrated Circuit Wide Band Amplifier
• Manufacturer: Renesas Electronics Corporation.

NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor should be attached to the V
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
4
PC1652G
Infrared ray reflow
VPS
Wave soldering
Pin part heating
This product should be soldered in the following recommended conditions.
Note It is the storage days after opening a dry pack, the storage conditions are 25 °C , less than 65 % RH.
Caution
For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-
Soldering Method
The combined use of soldering method is to be avoided (However, except the pin area heating
method).
Package peak temperature: 235 ° C, Hour: within 30 s.
(more than 210 ° C), Time: 3 times, Limited days: no.
Package peak temperature: 215 ° C, Hour: within 40 s.
(more than 200 ° C), Time: 3 times, Limited days: no.
Soldering tub temperature: less than 260 ° C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 ° C, Hour: within 3 s/pin.
Limited days: no.
Note
Data Sheet P12443EJ5V0DS00
Soldering Conditions
Note
CC
pin.
Note
Note
Other soldering methods and
Recommended
Condition Symbol
WS60-00-1
VP15-00-3
IR35-00-3
PC1652G