s29gl064m Meet Spansion Inc., s29gl064m Datasheet - Page 23

• Manufacturer Part Number: s29gl064m
• Description: 3.0 Volt-only Page Mode Flash Memory Featuring 0.23 ?m Mirrorbit Process Technolog
• Manufacturer: Meet Spansion Inc.

Ordering Information: S29GL256M
Notes:
1.
2.
3.
4.
5.
February 7, 2007 S29GL-M_00_B8
This product has been retired and is not recommended for designs. For new and current designs, S29GL256P supersedes S29GL256M, and is the
factory-recommended migration path. Please refer to the S29GL-P Datasheet for specifications and ordering information.
S29GL256M
Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
TSOP package marking omits the packing type designator from the ordering part number.
BGA package marking omits leading “S29” and packing type designator from the ordering part number.
100% Matte Sn is used for Pb-free TSOP plating.
Contact your Spansion representative for availability of the 100 ns speed option.
S29GL256M
Number
Device
DEVICE NUMBER/DESCRIPTION
S29GL256M
256 Megabit Page-Mode Flash Memory Manufactured using 0.23 µm MirrorBit™
Process Technology, 3.0 Volt-only Read, Program, and Erase
Standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the following:
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
11
(Note
Option
10, 11
Speed
T
5)
A
S29GL256M Valid Combinations
I
& Temperature Range
Table 4. S29GL256M Ordering Options
Package, Material,
D a t a
R1
TAI,TFI
FAI,FFI
S29GL-M MirrorBit
0
Valid Combinations
S h e e t
PACKING TYPE
0
2
3
Model Number
R1
R2
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
F
SPEED OPTION
See Product Selector Guide and Valid Combinations
= Tray
= 7” Tape and Reel
= 13” Tape and Reel
= x8/x16, V
= x8/x16, V
= Industrial (–40
= Standard
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fortified Ball-Grid Array Package
sector protected when WP#/ACC=V
protected when WP#/ACC=V
TM
Flash Family
Number
R1,R2
Model
CC
CC
=3.0-3.6V, Uniform sector device, lowest address sector
=3.0-3.6V, Uniform sector device, highest address
°
C to +85
(Note
Packing
0,2,3
Type
°
C)
1)
IL
TS056 (2, 3, 4)
LAC064 (3)
IL
Package Description
(Notes)
TSOP
Fortified BGA
21