s29gl032n90tai010 Meet Spansion Inc., s29gl032n90tai010 Datasheet - Page 16

• Manufacturer Part Number: s29gl032n90tai010
• Description: S29gl064n, 64 Megabit, 3.0-volt Only Page Mode Flash Memory Featuring 110 Nm Mirrorbit Process Technology
• Manufacturer: Meet Spansion Inc.

7.
8. Device Bus Operations
16
S29GL064N
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
Device Number
packed in Types 0, 2, or 3.
S29GL064N
Ordering Information–S29GL064N
DEVICE NUMBER/DESCRIPTION
S29GL064N, 64 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit
90
T
S29GL064N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
This section describes the requirements and use of the device bus operations, which are initiated through the
internal command register. The command register itself does not occupy any addressable memory location.
The register is a latch used to store the commands, along with the address and data information needed to
Speed Option
A
90
11
90
11
90
90
11
I
02
2
S29GL064N Valid Combinations
PACKING TYPE
0
2
3
MODEL NUMBER
01 = x8/x16, V
02 = x8/x16, V
03 = x8/x16, V
04 = x8/x16, V
06 = x16, V
07 = x16, V
V1 = x8/x16, V
V2 = x8/x16, V
V6 = x16, V
V7 = x16, V
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
B
F
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
Package, Material &
Temperature Range
= Tray
= 7-inch Tape and Reel
= 13-inch Tape and Reel
= Industrial (–40°C to +85°C)
= Standard
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fine-pitch Ball-Grid Array Package
= Fortified Ball-Grid Array Package
Table 7.1 S29GL064N Valid Combinations
®
BFI
TFI
FFI
Process Technology, 3.0 Volt-only Read, Program, and Erase
CC
CC
CC
CC
CC
CC
CC
CC
= 2.7 – 3.6 V, Uniform sector, WP# = V
= 2.7 – 3.6 V, Uniform sector, WP# = V
CC
CC
= 2.7 – 3.6 V, V
= 2.7 – 3.6 V, V
(Note 4)
S29GL-N MirrorBit
= V
= V
= 2.7 – 3.6 V, Top boot sector, WP#/ACC = V
= 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V
= 2.7 – 3.6 V, V
= 2.7 – 3.6 V, V
IO
IO
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
IO
IO
= 1.65 - 3.6 V, Uniform sector, WP# = V
= 1.65 - 3.6 V, Uniform sector, WP# = V
Model Number
IO
IO
03, 04, 06, 07
01, 02, 03, 04
D a t a
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
V6, V7
V1, V2
V1, V2
03, 04
01, 02
®
Flash Family
S h e e t
IL
IL
protects lowest addressed sector
protects highest addressed sector
(Note 4)
Packing
(Note 1)
0, 2, 3
Type
IL
protects top two addressed sectors
IL
IL
IL
protects bottom two addressed sectors
protects highest addressed sector
protects lowest addressed sector
TS048
TS056
VBK048
LAA064
Valid Combinations
Valid Combinations list configurations
planned to be supported in volume for this
device. Consult your local sales office to
confirm availability of specific valid
combinations and to check on newly
released combinations.
IL
IL
protects lowest addressed sector
protects highest addressed sector
(Note 2)
(Note 2)
S29GL-N_01_10 April 10, 2008
IL
IL
(Note 3)
(Note 3)
protects highest addressed sector
protects lowest addressed sector
Package Description
TSOP
TSOP
Fine-pitch BGA
Fortified BGA