EMTG30 EM Microelectronic, EMTG30 Datasheet

EMTG30

Manufacturer Part Number

EMTG30

Description

30KB Ultra Low Cost Flash Smart Card IC

Manufacturer

EM Microelectronic

Datasheet

1.EMTG30.pdf (3 pages)

Current page: 1 of 3
Download datasheet (91Kb)

Environment

CPU

Idle Modes

Security

Memory Control

Voltage Supply Class A, B: 3.0V to 5.0V ± 10%

-25 to +85 °C Operating Temperature

Max supply current 6mA @ 15MHz, Class B

> 4 kV ESD Protection HBM

Software compatible CMOS 80X51 industry standard

Accelerated architecture with 16 bit CPU performance level

Up to 30 MHz internal CPU clock

Idle and Stop mode selectable modes

NVM update operation with CPU in idle/halt mode

IO Transmission and Reception with CPU in idle mode

Max Idle current / Clock stopped : 100 uA

Unique chip identification number

Notification of tampering

Internal clock generation

IC operates under regulated voltage

DPA/SPA resistance mechanisms

Under / Over voltage sensors (Vcc)

General Purpose Non Volatile Memory: GPNVM

Secure Memory Management Mechanism

Fast Byte program: 40 us / Byte

GP NVM Page Erase: 2 ms

EM MICROELECTRONIC -

EMTG30

Boot ROM

SECURITY MODULE

Loader

Random Number

30KB Ultra Low Cost Flash Smart Card IC

UVD / OVD

DPA / SPA

protections

Generator

System (1KB)

GPNVM

512 Bytes

RAM

Power Management System

Secure Memory Management

30MHz on-chip Oscillator

Controlled Clock Divider

Fast Architecture

256 Bytes RAM

80X51 Core

30K Bytes

GPNVM User

I/O

Memories

Chip Forms

Typical Application:

MARIN SA

[ code]

ISO 7816-3 compliant electrical interface

ISO 7816-3 compliant interface with T=0 and T=1 protocols

ETU Timer/Counter replacing 8051 T0/T1 Timers

768 bytes RAM (256B Local RAM + 512B XRAM)

30KB GPNVM (User) = 240 Pages of 128 B

1KB GPNVM (System) = 8 Pages of 128 B

10 years data retention

GPNVM Cycling Endurance > 100 K cycles

BootROM loader T0 and T14 compatible

Boot loader commands set extension capabilities

8” Wafer sawn or unsawn

Back grinding and distressing options

180 microns max thickness

Modules

SIM card GSM Phase2 or Phase2+ 16KB

Development tools fully integrated within Keil uVision2/3

DevKit emulator, examples, documentation samples

Flexible code / data memory allocation

Power-on Reset

Internal V

User Code, constant storage (ROM)

User Non Volatile Data storage (EEPROM)

System parameters

Loader extensions

Backup buffer / hard API code

ISO 7816-3

Interface 3G

ETU Timer

Voltage Regulator

A, B on-chip

www.emmicroelectronic.com

[ data ]

www.DataSheet4U.com

Theseus

EMTG30

Gold 30

Related parts for EMTG30

EMTG30 Summary of contents

Page 1

... Controlled Clock Divider Fast Architecture 80X51 Core 256 Bytes RAM Secure Memory Management [ code] 512 Bytes 30K Bytes GPNVM User RAM Flexible code / data memory allocation 1 TM Theseus Gold 30 www.DataSheet4U.com EMTG30 on-chip Voltage Regulator ETU Timer ISO 7816-3 Interface 3G [ data ] www.emmicroelectronic.com ...

Page 2

... EM MICROELECTRONIC - Introduction EMTG30 is a member of the Theseus family of devices designed specifically for smart card applications software compatible with the industry standard 8051 micro-controller, to guarantee the maximum availability of qualified software. The hardware implementation of the core is a modern design not relying on microcode, with an increase times on a standard 8051's clocks per instruction ...

Page 3

... F IN OUT Symbol Condition = +20 μ Ohmax -20μA OL Olmax OUT 3 Theseus www.DataSheet4U.com EMTG30 Unit max +0 +60 mW +125 °C Unit max +85 °C 5 (Note 1) mA μA 200 (Note 2) μA 100 (Note min max ...

Related keywords

EMTG30 datasheet
EMTG30 data sheet
EMTG30 pdf datasheet
EMTG30 component
EMTG30 part
EMTG30 distributor
EMTG30 RoHS
EMTG30 datasheet download