EMTCG256-3G EM Microelectronic, EMTCG256-3G Datasheet
EMTCG256-3G
Manufacturer Part Number
EMTCG256-3G
Description
256kb Flash Smart Card Ic + Crypto
Manufacturer
EM Microelectronic
Datasheet
1.EMTCG256-3G.pdf
(3 pages)
Environment
CPU
Idle Modes
Cryptography Resources
Memory Control
Block Diagram
Copyright 2004, Rev A, EM Microelectronic-Marin SA
Voltage Class A, B and C : 1.8V, 3-5V supply ± 10%
-25°C to +85°C operating temperature
Max supply current 10 mA at 5.5 V and 30 MHz
Max supply current 6 mA at 3.3 V and 30 MHz
Max supply current 4 mA at 1.8 V and 10 MHz
> 4 KV ESD Protection HBM
Software compatible CMOS 80X51 industry standard
“far” addressing support extending ‘xdata’ up to 8MB
Accelerated architecture with 16 bit CPU performance level
Linear code / data addressing (no bank switching)
Up to 30 MHz internal CPU clock
Idle and Stop mode selectable modes
NVM operation possible with CPU in idle mode
IO Transmission and Reception with CPU in idle mode
Max idle current 200 µA
DES / TDES Hardware accelerator
CBC mode Hardware acceleration
Hardware Random Number Generator FIPS140-2
Memory Management Unit (MMU) + HW Firewall
Memory physical access rights management
Extended addressing capability with Java Mode
EEPROM Erase write control
EEPROM Fast program in FLASH Mode 40 µs / Byte
EEPROM Multiple Page Erase up to 128 Bytes
EEPROM Fast write in Flash mode
OTPROM Bank Erase (32KB)
FLASH Block Erase (2KB)
EM MICROELECTRONIC
DPA / SPA protections
SECURITY MODULE
Random Number
DES / TDES
UVD / OVD
CBC / EBC
4096 Bytes
UTD / OTD
UFD / OFD
Generator
ISO 3309
CRC16
256KB Flash Smart Card IC + Crypto
RAM
MMU (Memory Management Unit Interface)
Power Management System
30MHz on-chip Oscillator
Controlled Clock Divider
Fast Architecture
128K Bytes
OTPROM
256 Bytes RAM
80X51 Core
Charge Pump: Internal V
– MARIN SA
I/O
Security
Memory
Delivery form
Development kit
Applications
ISO 7816-3 compliant electrical interface
ISO 7816-3 compliant reset and response T=0 T=1 protocols
OTPROM / Flash block physical access rights
CRC16 module hardware accelerator ISO3309
Unique chip identification number
Notification of tampering
Out of frequency, voltage, temperature detection
Internal clock and voltage generation
DPA/SPA resistance mechanisms
Security target EAL4+
4KB XRAM +256B Internal RAM
128KB OTPROM 4 blocks of 32KB
64KB FLASH BLOCK 32 blocks of 2KB
64KB EEPROM
Backlapped and distressed 8” wafers to 180 µm
Options: Sawn wafers on frame, Modules
Emulation platform (EME4652) fully integrated in Keil
uVision2 Debugger with all debugging facilities
Starter Kit EMSK4600 with uVision2 integration:
Mobile communication : GSM: Phase 2, 2+ WIB, OTA,
WLAN GPRS, UMTS, CDMA, Java Card Platform
Banking, Health, loyalty, membership cards
1
10 year data retention
>300k read write cycles
OTP, Flash blocks, EEPROM code download
EEPROM data download (personalization)
64K Bytes
BLOCKS
FLASH
Internal RST
Internal V
PP
ISO 7816-3
Interface 3G
DD
Generation
EMTCG256-3G
Reset Control and
Voltage Regulator
Power-on Reset
A, B, C on-chip
64K Bytes
EEPROM
Theseus™ Gold 256 3G
www.emmicroelectronic.com
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EMTCG256-3G Summary of contents
Page 1
... Bytes RAM MMU (Memory Management Unit Interface) 64K Bytes 128K Bytes FLASH OTPROM BLOCKS Charge Pump: Internal V 1 Theseus™ Gold 256 3G EMTCG256- on-chip Internal V DD Voltage Regulator Reset Control and Internal RST Power-on Reset ISO 7816-3 Interface 3G 64K Bytes ...
Page 2
... EM MICROELECTRONIC Introduction EMTCG256- member of the Theseus family of devices designed specifically for smart card applications software compatible with the industry standard 8051 micro-controller, to guarantee the maximum availability of qualified software. The hardware implementation of the core is a modern design not relying on microcode, with an increase times on a standard 8051's clocks per instruction ...
Page 3
... F IN OUT Symbol Condition +20µ Ohmax -20µA OL Olmax 30pF OUT 3 Theseus™ Gold 256 3G EMTCG256-3G Unit max 0 +60 mW +125 °C Unit max +85 °C 5 (Note (Note 1) mA 200 (Note 2) µA min max ...