MC74HC390ADTR2 ON Semiconductor, MC74HC390ADTR2 Datasheet - Page 3

MC74HC390ADTR2

Manufacturer Part Number

MC74HC390ADTR2

Description

IC COUNTER RPPL DUAL 4ST 16TSSOP

Manufacturer

ON Semiconductor

Series

74HCr

Datasheet

1.MC74HC390ANG.pdf (10 pages)

Specifications of MC74HC390ADTR2

Logic Type

Divide-by-N

Number Of Elements

Number Of Bits Per Element

Reset

Asynchronous

Count Rate

50MHz

Trigger Type

Negative Edge

Voltage - Supply

2 V ~ 6 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

16-TSSOP

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Direction

Timing

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Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress

ratings only. Functional operation above the Recommended Operating Conditions is not implied.

Extended exposure to stresses above the Recommended Operating Conditions may affect device

reliability.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).

MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

DC ELECTRICAL CHARACTERISTICS

Symbol

, V

out

stg

, t

out

Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î Î Î Î Î Î

DC Supply Voltage (Referenced to GND)

DC Input Voltage (Referenced to GND)

DC Output Voltage (Referenced to GND)

DC Input Current, per Pin

DC Output Current, per Pin

DC Supply Current, V

Power Dissipation in Still Air,

Storage Temperature

Lead Temperature, 1 mm from Case for 10 Seconds

DC Supply Voltage (Referenced to GND)

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature, All Package Types

Input Rise and Fall Time

Minimum High−Level Input

Voltage

Maximum Low−Level Input

Voltage

Minimum High−Level Output

Voltage

Maximum Low−Level Output

Voltage

(Figure 1)

SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

Parameter

Plastic DIP, SOIC or TSSOP Package

Parameter

and GND Pins

Î Î Î Î Î Î Î Î Î

TSSOP Package†

(Voltages Referenced to GND)

SOIC Package†

out

= V

| v 20 mA

= 0.1 V or V

Plastic DIP†

Test Conditions

or V

= 2.0 V

= 3.0 V

= 4.5 V

= 6.0 V

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Î Î Î Î Î

Î Î Î

– 0.1 V

out

– 0.5 to V

– 55

Min

2.0

– 0.5 to + 7.0

– 65 to + 150

| v 2.4 mA

| v 4.0 mA

| v 5.2 mA

| v 2.4 mA

| v 4.0 mA

| v 5.2 mA

Value

± 20

± 25

± 50

Î Î Î

750

500

450

260

Î Î Î Î

+ 125

1000

Max

600

500

400

6.0

+ 0.5

Î Î Î

2.0

3.0

4.5

6.0

2.0

3.0

4.5

6.0

2.0

4.5

6.0

3.0

4.5

6.0

2.0

4.5

6.0

3.0

4.5

6.0

Unit

Î Î Î Î Î Î Î Î Î

Î Î Î Î

– 55 to

25_C

3.15

1.35

2.48

3.98

5.48

0.26

1.5

2.1

4.2

0.5

0.9

1.8

1.9

4.4

5.9

0.1

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, V

range GND v (V

tied to an appropriate logic voltage

level (e.g., either GND or V

Unused outputs must be left open.

Guaranteed Limit

out

This device contains protection

Unused inputs must always be

Î Î Î

should be constrained to the

v 85_C

3.15

1.35

2.34

3.84

5.34

0.33

1.5

2.1

4.2

0.5

0.9

1.8

1.9

4.4

5.9

0.1

Î Î Î Î

v 125_C

or V

3.15

1.35

2.20

3.70

5.20

0.40

1.5

2.1

4.2

0.5

0.9

1.8

1.9

4.4

5.9

0.1

out

Î Î Î

) v V

Unit

and

MC74HC390ADTR2 ON Semiconductor, MC74HC390ADTR2 Datasheet - Page 3

MC74HC390ADTR2

Specifications of MC74HC390ADTR2

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