MAX16051 Maxim Integrated Products, MAX16051 Datasheet - Page 2

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MAX16051

Manufacturer Part Number
MAX16051
Description
Voltage Monitors/Sequencer Circuits
Manufacturer
Maxim Integrated Products
Datasheet
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
REM, OUT_, DISC_.................................................-0.3V to +30V
RESET, SHDN, SET_, FAULT, EN_HOLD, EN, DELAY,
CP_OUT.........................................................-0.3V to (V
RESET Current ....................................................................50mA
DISC_ Current ...................................................................180mA
Input/Output Current (all other pins) ...................................20mA
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
2
Operating Voltage Range
(Note 2)
Operating Voltage
Regulated Supply Voltage
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Supply Current
MONITORED ANALOG INPUTS
SET_ Threshold
SET_ Threshold Hysteresis
SET1–SET4 Input Current
SET5 Input Current
SET_ Threshold Tempco
Overvoltage Threshold
Overvoltage Threshold Hysteresis
EN Threshold
EN Threshold Hysteresis
EN Input Current
SEQUENCING, CAPACITOR DISCHARGE, AND SEQUENCE TIMING OUTPUTS
OUT_ Output Low Voltage
OUT_ Leakage Current
DISC_ Output Pulldown Current
DISC_ Output Leakage Current
DISC_ Power Low Threshold
CC
OV_OUT, ABP, TIMEOUT, SEQ_...........................-0.3V to +6V
CC
_______________________________________________________________________________________
.........................................................................-0.3V to +30V
= 2.7V to 13.2V, V
PARAMETER
EN
= V
ABP
, T
A
V
I
SYMBOL
I
ΔV
V
UVLO_HYS
V
V
I
LKG_DISC
LKG_OUT
= T
V
V
OL_DISC
V
V
EN_HYS
OL_OUT
TH_HYS
V
V
I
TH_OV
TH_EN
TH_PL
V
I
UVLO
V
SET5
I
TH/_TC
I
SET
CCR
ABP
CC
EN
J
CC
TH
= -40°C to +85°C, unless otherwise noted. Typical values are at T
Voltage on V
operational
V
V
I
ABP)
Minimum voltage on ABP, ABP rising
ABP falling
V
SET_ falling
SET_ rising
V
V
SET_ falling
SET_ rising
EN_ falling
EN_ rising
V
V
V
V
Pulldown current during fault condition or
power-down mode, V
V
DISC_ falling
ABP
DISC_
CC
CC
SET_
SET5
EN
CC
CC
OUT_
DISC_
= 0.5V
CC
rising
= 3.3V, all OUT_ = high, no load
= 3.3V, I
= 1.8V, I
= 1mA (external sourcing current from
= 0.5V
= 0.5V (MAX16051 only)
= 12V, OUT_ asserted
= V
= 3.3V, not in power-down mode
+ 6V)
OUT_
CC
SINK
SINK
CONDITIONS
to ensure the device is fully
= V
= 3.2mA
= 100µA
Continuous Power Dissipation (T
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
* As per JEDEC51 Standard (Multilayer Board).
RESET
DISC_
28-Pin (4mm x 4mm) Thin QFN (derate 28.6mW/°C
above +70°C) ............................................................2285mW*
= low, voltage on
= 1V
-100
0.492
0.541
0.492
-100
MIN
2.45
200
-30
2.7
2.1
A
= +70°C)
TYP
0.55
100
250
1.8
2.3
0.7
0.5
0.5
0.5
0.5
0.5
30
85
www.DataSheet4U.com
A
= +25°C.) (Note 1)
+100
0.508
+100
0.558
0.508
MAX
13.2
2.90
+30
300
1.1
0.3
0.3
1
1
%V
%V
ppm/°C
UNITS
%V
mV
mA
mA
mV
nA
µA
nA
µA
µA
TH_OV
TH_EN
V
V
V
V
V
V
V
V
TH

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