74AVC16244DGG,518 NXP Semiconductors, 74AVC16244DGG,518 Datasheet - Page 10

• Manufacturer Part Number: 74AVC16244DGG,518
• Description: CI BUFF DVR TRI-ST 16BIT 48TSSOP
• Manufacturer: NXP Semiconductors
• Series: 74AVCr

Specifications of 74AVC16244DGG,518

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 4
• Number Of Bits Per Element: 4
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TSSOP
• Logic Family: AVC
• Number Of Channels Per Chip: 16
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 12 mA
• Low Level Output Current: 12 mA
• Minimum Operating Temperature: - 40 C
• Output Type: 3-State
• Propagation Delay Time: 2.6 ns (Typ) at 1.2 V, 1.8 ns (Typ) at 1.5 V, 1.7 ns (Typ) at 1.8 V, 1.3 ns (Typ) at 2.5 V, 1.1 ns (Typ) at 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74AVC16244DG-T; 74AVC16244DG-T; 935264443518

Philips Semiconductors
PACKAGE OUTLINE
1999 Nov 15
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
DIMENSIONS (mm are the original dimensions).
16-bit buffer/line driver; 3-state
(3.6 V tolerant)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT362-1
48
1
Z
max.
y
1.2
A
pin 1 index
0.15
0.05
A
1
1.05
0.85
A
2
IEC
0.25
A
3
e
D
0.28
0.17
b
p
MO-153ED
JEDEC
0.2
0.2
0.1
0.1
c
REFERENCES
12.6
12.4
D
(1)
0
b
p
E
6.2
6.0
(2)
w
scale
EIAJ
M
2.5
10
0.5
25
24
e
H
8.3
7.9
c
E
5 mm
A
L
1
2
A
1
0.8
0.4
L
p
0.50
0.35
Q
H
E
E
PROJECTION
EUROPEAN
detail X
0.25
v
L
L
0.08
p
w
74AVC16244
Q
Product specification
(A )
0.1
y
3
ISSUE DATE
A
93-02-03
95-02-10
0.8
0.4
Z
A
X
SOT362-1
v
M
8
0
o
o
A