NFSG036B Nichia, NFSG036B Datasheet - Page 16

• Manufacturer Part Number: NFSG036B
• Manufacturer: Nichia

Specifications of NFSG036B

• Size Lxwxh (mm): 3.5x3.5x0.8
• Lumi-nous Inten-sity Typ(cd): 4.5
• Lumi-nous Flux Typ(lm)): 12.1
• Forward Voltage Vf(v) Typ: 4.00
• Forward Voltage Vf(v) Max: 4.50
• Directivity (degree): 120
• If (ma): 150
• Mounting Style: Through Hole

(3) Handling Precautions
(4) Design Consideration
(5) Electrostatic Discharge (ESD)
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface
● When handling the product with tweezers, make sure that excessive force is not applied to the resin portion of the product.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not with hands.
● If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
● The products are sensitive to static electricity or surge voltage. An ESD event may damage its die
● Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.
● If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,
● When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs
● ESD-damaged LEDs may have a current flow at low voltage, or no longer light up at low current.
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure
due to package damage and/or wire breakage.
Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed,
and wire to be broken, and thus resulting in catastrophic failure.
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
Thermal stress during use can cause the solder joints to crack.
or reduce its reliability performance. When handling the products, measures against electro static discharge,
including the followings, are strongly recommended.
Also note that surge protection should be considered in the design of customer products.
including the followings, are strongly recommended.
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement or light up test
at low current. (the recommended current is 1mA or lower)
Dissipating the charge with conductive materials
Preventing the charge generation with moisture
Neutralizing the charge with ionizers
Eliminating the charge;
Wrist strap, ESD footwear and garments, ESD floors
Grounding the equipment and tools at workstation
ESD table/shelf mat (conductive materials)
Failure Criteria: V
F
<2.0V at I
F
=0.5mA
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