NFSG036B Nichia, NFSG036B Datasheet - Page 14

• Manufacturer Part Number: NFSG036B
• Manufacturer: Nichia

Specifications of NFSG036B

• Size Lxwxh (mm): 3.5x3.5x0.8
• Lumi-nous Inten-sity Typ(cd): 4.5
• Lumi-nous Flux Typ(lm)): 12.1
• Forward Voltage Vf(v) Typ: 4.00
• Forward Voltage Vf(v) Max: 4.50
• Directivity (degree): 120
• If (ma): 150
• Mounting Style: Through Hole

RELIABILITY
(1) Tests and Results
(2) Failure Criteria
NOTES:
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
High Temperature
Storage
Temperature Humidity
Storage
Low Temperature
Storage
Room Temperature
Operating Life
High Temperature
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
Vibration
Electrostatic Discharges
Board Bending
Soldering Joint Shear
Strength
#1
#2
Criteria #
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, R
2) Measurements are performed after allowing the LEDs to return to room temperature.
Test
Forward Voltage(V
Luminous Flux(Φ
Solderability
Items
JEITA ED-4701
300 301
JEITA ED-4701
303 303A
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
JEITA ED-4701
400 403
JEITA ED-4701
300 304
JEITA ED-4702B
003
JEITA ED-4702B
002 3
Reference
Standard
V
)
F
)
I
I
-
F
F
=150mA
=150mA
T
Precondition: 30°C, 70%RH, 168hr
T
Lead-free Solder(Sn-3.0Ag-0.5Cu)
0°C to 100°C, 15sec dwell
-40°C(30min)~25°C(5min)~
100°C(30min)~25°C(5min)
T
T
T
T
Test board: See NOTES below
T
Test board: See NOTES below
60°C, RH=90%, I
Test board: See NOTES below
T
Test board: See NOTES below
200m/s
4cycles, 4min, each X, Y, Z
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
alternately positive or negative
1bend to a deflection of 3mm
for 5±1sec
5N, 10±1sec
Conditions
sld
sld
A
A
A
A
A
A
=100°C
=60°C, RH=90%
=-40°C
=25°C, I
=70°C, I
=-40°C, I
=260°C, 10sec, 2reflows,
=245±5°C, 5sec,
2
, 100~2000~100Hz,
Test Conditions
F
F
=150mA
=100mA
F
=150mA
F
>Initial value×1.1
<Initial value×0.7
Less than 95% solder coverage
=100mA
Failure Criteria
θJA
≈140°C/W
20cycles
100cycles
500hours
500hours
500hours
500hours
500hours
500hours
500hours
48minutes
Duration
Test
Criteria
Failure
#1
#2
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#
Failed/Tested
Units
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
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