IGC19T60Q Infineon Technologies, IGC19T60Q Datasheet
IGC19T60Q
Specifications of IGC19T60Q
Related parts for IGC19T60Q
IGC19T60Q Summary of contents
Page 1
... Electrically conductive epoxy glue and soft solder (temperature budget: 290°C for 1min. or 260°C for 1.5min.) 0.65mm ; max 1.2mm Ambient atmosphere air, Temperature 17°C – 25°C, Acc. to IEC62258-3: Atmosphere >99% Nitrogen or inert gas, Humidity <25%RH, Temperature 17°C – 25°C, < 6 month IGC19T60Q G Package sawn on foil 70 738 Photoimide Ni Ag – ...
Page 2
... V CES = GES Symbol Conditions V =15V CEsat IGC19T60Q Value 600 1 ) 120 20 -40 ... +175 5 Value min. typ 600 C =40A 1.48 1. 4.2 5 =0V GE =20V GE none Value min. ...
Page 3
... Switching characteristics and thermal properties are depending strongly on module design and mounting technology and can therefore not be specified for a bare die. This chip data sheet refers to the device data sheet Edited by INFINEON Technologies, IFAG IPC TD VLS, L7448C, Rev 1.0, 30.01.2012 IGC19T60Q IKW40N60H3 Rev 2.2 ...
Page 4
... Chip Drawing Emitter G = Gate Edited by INFINEON Technologies, IFAG IPC TD VLS, L7448C, Rev 1.0, 30.01.2012 IGC19T60Q E ...
Page 5
... If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, IFAG IPC TD VLS, L7448C, Rev 1.0, 30.01.2012 Subjects (major changes since last revision) IGC19T60Q Date ...