BSD840N Infineon Technologies, BSD840N Datasheet - Page 2

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BSD840N

Manufacturer Part Number
BSD840N
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSD840N

Package
SOT-363 dual
Vds (max)
20.0 V
Rds (on) (max) (@10v)
-
Rds (on) (max) (@4.5v)
-
Rds (on) (max) (@2.5v)
400.0 mOhm

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Rev 2.3
2)
of the PCB
Parameter
Thermal characteristics
Thermal resistance,
junction - ambient
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Drain-source leakage current
Gate-source leakage current
Drain-source on-state resistance
Transconductance
Performed on 40 mm
2
FR4 PCB. The traces are 1mm wide, 70μm thick and 20mm long; they are present on both sides
j
=25 °C, unless otherwise specified
Symbol Conditions
R
V
V
I
I
R
g
DSS
GSS
fs
(BR)DSS
GS(th)
thJA
DS(on)
minimal footprint
V
V
V
T
V
T
V
V
V
|V
I
D
page 2
j
j
GS
DS
DS
DS
GS
GS
GS
=25 °C
=150 °C
=0.71 A
DS
=V
=20 V, V
=20 V, V
=0 V, I
=8 V, V
=1.8 V, I
=2.5 V, I
|>2|I
GS
, I
D
|R
D
D
DS
=250 µA
=1.6 µA
D
D
GS
GS
DS(on)max
=0 V
=0.19 A
=0.88 A
=0 V,
=0 V,
2)
,
min.
0.3
20
-
-
-
-
-
-
Values
0.55
typ.
373
270
2.5
-
-
-
-
-
max.
0.75
250
100
100
560
400
1
-
-
BSD840N
Unit
K/W
V
μA
nA
S
2011-07-14

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