VN5010AKE STMICRO, VN5010AKE Datasheet - Page 24

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VN5010AKE

Manufacturer Part Number
VN5010AKE
Description
Manufacturer
STMICRO
Datasheet
Package and PCB thermal data
4
4.1
Note:
24/31
Package and PCB thermal data
PowerSSO-24
Figure 28. PowerSSO-24
Layout condition of R
area= 77 mm x 86 mm, PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
Figure 29. R
RTHj_amb(°C/W)
55
50
45
40
35
30
0
thj-amb
TM
th
vs PCB copper area in open box free air condition
and Z
thermal data
2
TM
th
PC board
Doc ID 13218 Rev 6
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heatsink area (cm^2)
4
2
).
6
8
VN5010AK-E
10

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