ISL55141IVZ Intersil, ISL55141IVZ Datasheet - Page 13

• Manufacturer Part Number: ISL55141IVZ
• Description: IC COMP CMOS HS 18V 14-TSSOP
• Manufacturer: Intersil
• Type: Windowr

Specifications of ISL55141IVZ

• Number Of Elements: 1
• Voltage - Supply: 10 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Outline Drawing
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
6.40
0.20 C B A
4.40 ±0.10
2
SEATING
PLANE
(0.65 TYP)
(5.65)
C
0.10 C
3
TYPICAL RECOMMENDED LAND PATTERN
H
20
1
13
6.50 ±0.10
SIDE VIEW
TOP VIEW
1
0.65
- 0.05
0.10
3
0.25 +0.05/-0.06 5
ISL55141, ISL55142, ISL55143
M
C B A
(0.35 TYP)
10
9
A
I.D. MARK
PIN #1
(1.45)
B
1.20 MAX
NOTES:
1.
2.
3.
4.
5.
6.
7.
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
0.90 +0.15/-0.10
0.15 MAX
0.05 MIN
SEE DETAIL "X"
0.09-0.20
DETAIL "X"
END VIEW
1.00 REF
GAUGE
PLANE
0.60 ±0.15
0°-8°
March 1, 2011
FN6230.2
0.25