LTC1440IS8 Linear Technology, LTC1440IS8 Datasheet - Page 14

IC COMP W/REF LP SINGLE 8-SOIC

LTC1440IS8

Manufacturer Part Number
LTC1440IS8
Description
IC COMP W/REF LP SINGLE 8-SOIC
Manufacturer
Linear Technology
Type
with Voltage Referencer
Datasheet

Specifications of LTC1440IS8

Number Of Elements
1
Output Type
CMOS, TTL
Voltage - Supply
2 V ~ 11 V, ±1 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTC1440IS8
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC1440IS8
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LTC1440IS8#TRPBF
Manufacturer:
PHI
Quantity:
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PACKAGE DESCRIPTIO
LTC1440/LTC1441/LTC1442
14
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(.0165 ± .0015)
0.42 ± 0.038
GAUGE PLANE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
2.38 ±0.05
TYP
(2 SIDES)
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
0.254
(.010)
U
0.675 ±0.05
PACKAGE
OUTLINE
DETAIL “A”
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1698)
0° – 6° TYP
(.0256)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
8-Lead Plastic MSOP
TOP MARK
(.021 ± .006)
0.53 ± 0.152
(NOTE 6)
PIN 1
MS8 Package
0.200 REF
DD Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
SEATING
PLANE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.65
BSC
0.75 ±0.05
1
3.00 ±0.10
8
(4 SIDES)
7 6 5
2 3
0.00 – 0.05
4
1.65 ± 0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
(.034)
0.52
0.86
REF
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD8) DFN 1203
144012fd

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