LPC1114FHI33 NXP Semiconductors, LPC1114FHI33 Datasheet - Page 95
![The LPC1114FHI33 is an ARM Cortex-M0 microcontroller and it can operate up to 50 MHz](/photos/41/52/415286/sot617-3_3d_sml.gif)
LPC1114FHI33
Manufacturer Part Number
LPC1114FHI33
Description
The LPC1114FHI33 is an ARM Cortex-M0 microcontroller and it can operate up to 50 MHz
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1110FD20.pdf
(103 pages)
- Current page: 95 of 103
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NXP Semiconductors
LPC111X
Product data sheet
Fig 57. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 7 — 1 March 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
95 of 103
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