BAS101_BAS101S NXP Semiconductors, BAS101_BAS101S Datasheet - Page 7

• Manufacturer Part Number: BAS101_BAS101S
• Description: High-voltage switching diodes, encapsulated in a SOT23 small Surface-MountedDevice (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
11. Soldering
BAS101_BAS101S_2
Product data sheet
Fig 7.
Fig 8.
4.60
4.00
Dimensions in mm
Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Wave soldering footprint SOT23 (TO-236AB)
1.20
3.00
0.85
0.85
1.30
Rev. 02 — 14 December 2009
2
2
3.40
2.80
4.50
3
1.00
2.90
2.50
3.30
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
MSA439
0.60
(3x)
BAS101; BAS101S
2.70
preferred transport direction during soldering
High-voltage switching diodes
solder lands
solder resist
occupied area
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2009. All rights reserved.
MSA427
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