PMEG3015EH_EJ NXP Semiconductors, PMEG3015EH_EJ Datasheet - Page 6
PMEG3015EH_EJ
Manufacturer Part Number
PMEG3015EH_EJ
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with anintegrated guard ring for stress protection, encapsulated in small and flat lead SMD plasticpackages
Manufacturer
NXP Semiconductors
Datasheet
1.PMEG3015EH_EJ.pdf
(9 pages)
NXP Semiconductors
10. Soldering
PMEG3015EH_EJ_3
Product data sheet
Fig 6.
Fig 7.
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD323F (SC-90)
1.65
1.6
0.95
(2×)
1.1
Rev. 03 — 13 January 2010
0.50
(2×)
PMEG3015EH; PMEG3015EJ
30 V, 1.5 A ultra low V
4.4
2.9
1.6
4
3.05
2.80
2.10
1.60
0.50
001aab169
1.1 1.2
0.60
F
MEGA Schottky barrier rectifiers
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
6 of 9