PMEG3015EH_EJ NXP Semiconductors, PMEG3015EH_EJ Datasheet
PMEG3015EH_EJ
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PMEG3015EH_EJ Summary of contents
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PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V Rev. 03 — 13 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ...
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... Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter FRM I FSM P tot T j PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V Pinning Description cathode anode Ordering information Package Name Description - plastic surface mounted package; 2 leads SC-90 plastic surface mounted package ...
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... Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 7. Characteristics Table amb Symbol [1] Pulse test: t PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V Limiting values …continued Conditions ambient temperature storage temperature Thermal characteristics Parameter thermal resistance from junction to ambient PMEG3015EH PMEG3015EJ ...
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... T amb = −40 °C (5) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V 006aaa293 I R (μA) (5) 0.4 0.5 0.6 V (V) F Fig 2 ...
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... Fig 4. Package outline SOD123F 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG3015EH PMEG3015EJ [1] For further information and the availability of packing methods, see PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V 1.2 1.0 0.55 0.35 0.25 0.10 ...
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... NXP Semiconductors 10. Soldering Fig 6. Fig 7. PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V 4.4 4 2.9 1.6 2.1 1.6 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Reflow soldering footprint SOD123F 3.05 2.80 2.10 1.60 1.65 0.95 0.50 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Reflow soldering footprint SOD323F (SC-90) Rev. 03 — ...
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... PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V Data sheet status Change notice Product data sheet - Product data sheet - Product data sheet - Rev. 03 — 13 January 2010 MEGA Schottky barrier rectifiers F Supersedes PMEG3015EH_EJ_2 PMEG3015EJ_1 - © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13. Contact information For more information, please visit: For sales office addresses, please send an email to: PMEG3015EH_EJ_3 Product data sheet PMEG3015EH; PMEG3015EJ 30 V, 1.5 A ultra low V [3] Definition This document contains data from the objective specification for product development ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 13 January 2010 Document identifier: PMEG3015EH_EJ_3 ...