HA9P2556-9 Intersil, HA9P2556-9 Datasheet - Page 3

• Manufacturer Part Number: HA9P2556-9
• Description: IC MUX ANALOG 57MHZ MONO 16-SOIC
• Manufacturer: Intersil

Specifications of HA9P2556-9

• Function: Analog Multiplier
• Number Of Bits/stages: 4-Quadrant
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . . . . . . . 35V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
Electrical Specifications
MULTIPLIER PERFORMANCE
Transfer Function
Multiplication Error
Multiplication Error Drift
Scale Factor
Linearity Error
AC CHARACTERISTICS
Small Signal Bandwidth (-3dB)
Full Power Bandwidth (-3dB)
Slew Rate
Rise Time
Overshoot
Settling Time
Differential Gain
Differential Phase
V
V
THD + N
1MHz Feedthrough
5MHz Feedthrough
SIGNAL INPUT (V
Input Offset Voltage
Average Offset Voltage Drift
Input Bias Current
1. θ
Y
X
0.1dB Gain Flatness
0.1dB Gain Flatness
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
PARAMETER
X
, V
Y
, V
Z)
3
V
SUPPLY
(Note 2)
V
V
V
V
V
10V
(Note 5)
(Note 6)
(Note 6)
To 0.1%, (Note 5)
(Note 3)
(Note 3)
200mV
200mV
(Note 4)
200mV
200mV
X
X
X
Y
X
= ±15V, R
, V
, V
, V
= 200mV
= 200mV
P-P
Y
Y
Y
P-P
P-P
P-P
P-P
= ±3V, Full Scale = 3V
= ±4V, Full Scale = 4V
= ±5V, Full Scale = 5V
TEST CONDITIONS
, V
, V
, Other Channel Nulled
, Other Channel Nulled
F
P-P
P-P
X
Y
= 50Ω, R
= 5V,
= 5V,
, V
, V
X
Y
= 5V
= 5V
HA-2556
L
= 1kΩ, C
L
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature (Ceramic Package) . . . . . . . +175°C
Maximum Junction Temperature (Plastic Packages) . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
= 20pF, Unless Otherwise Specified.
16 Ld SOIC Package . . . . . . . . . . . . . .
16 Ld CERDIP Package. . . . . . . . . . . .
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
TEMP (°C)
Full
Full
Full
Full
Full
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
V
OUT
=
(Note 10)
A
MIN
420
(
------------------------------------------------------------------- -
4.0
2.0
V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
X+
–
V
X-
)
0.003
TYP
0.02
0.05
0.03
450
100
1.5
3.0
0.2
0.1
0.1
5.0
4.0
-65
-50
×
5
57
52
32
20
45
12
5
8
3
8
8
(
V
Y+
–
θ
(Note 10)
V
JA
Y-
MAX
0.25
0.5
0.2
0.3
15
25
15
20
(°C/W)
90
)
3
6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
75
–
(
V
Z+
–
θ
April 29, 2008
UNITS
V
JC
µV/°C
%/°C
MHz
MHz
MHz
V/µs
MHz
MHz
Z-
mV
mV
dB
dB
µA
µA
ns
ns
%
%
%
%
%
%
%
%
V
N/A
FN2477.6
°
(°C/W)
20
)