SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 312

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SAM9G10

Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G10

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
25.5.4.7
312
312
Hardware Configuration
Software Configuration
SAM9G35
SAM9G35
8-bit NAND Flash with NFD0_ON_D16 = 1
The following configuration has to be performed:
• Set NFD0_ON_D16 = 1 in the EBI Chip Select Assignment Register located in the bus matrix
• Assign the EBI CS3 to the NAND Flash by setting the bit EBI_CS3A in the EBI Chip Select
• Reserve A21 / A22 for ALE / CLE functions. Address and Command Latches are controlled
• Configure a PIO line as an input to manage the Ready/Busy signal.
• Configure Static Memory Controller CS3 Setup, Pulse, Cycle and Mode accordingly to NAND
memory space
Assignment Register
respectively by setting to 1 the address bit A21 and A22 during accesses.
Flash timings, the data bus width and the system bus frequency.
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11

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