SA5214D/01,112 NXP Semiconductors, SA5214D/01,112 Datasheet - Page 8

• Manufacturer Part Number: SA5214D/01,112
• Description: IC POSTAMP STATUS IND 20-SOIC
• Manufacturer: NXP Semiconductors
• Type: Postamplifierr

Specifications of SA5214D/01,112

• Applications: Optical Networks
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935275246112; SA5214D/01; SA5214D/01

Philips Semiconductors
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25 C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
1998 Oct 07
Postamplifier with link status indicator
ECN No.: 94620
1988 Sep 28
JAM
V
CCD
FLAG
GNDA
THRESH
V
CCA
5
4
3
6
7
8
C
GNDD
PKDET
9
2
Figure 6. SA5214 Bonding Diagram
V
OUT
LED
10
Ç Ç Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç
1
8
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
IN1B
20
11
R
PKDET
19
12
IN1A
R
HYST
15
13
16
14
17
18
IN2A
CAZP
Product specification
SA5214
OUT1B
CAZN
OUT1A
SD00490
IN2B