MAX9730ETI+T Maxim Integrated Products, MAX9730ETI+T Datasheet - Page 10

• Manufacturer Part Number: MAX9730ETI+T
• Description: IC AMP AUDIO PWR 2.4W G 28TQFN
• Manufacturer: Maxim Integrated Products
• Type: Class Gr

Specifications of MAX9730ETI+T

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 2.4W x 1 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Differential Inputs, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 28-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Class G amplifiers provide much better efficiency and
thermal performance than a comparable Class AB
amplifier. However, the system’s thermal performance
must be considered with realistic expectations and
include consideration of many parameters. This section
examines Class G amplifiers using general examples to
illustrate good design practices.
The exposed pad is the primary route of keeping heat
away from the IC. With a bottom-side exposed pad, the
PCB and its copper become the primary heatsink for
the Class G amplifier. Solder the exposed pad to a
large copper polygon that is connected to the ground
plane.
2.4W, Single-Supply, Class G Power Amplifier
10
______________________________________________________________________________________
( ) WLP PACKAGE
DEVICE SHOWN WITH A
*SYSTEM-LEVEL REQUIREMENT TYPICALLY 10μF
1μF
1μF
C
C
IN
IN
Thermal Considerations
10kΩ
10kΩ
R
R
IN-
IN-
CONTROL
V
SIGNAL
SHDN
= 12dB
10kΩ
10kΩ
TQFN Considerations
R
R
FB+
FB-
20kΩ
12 (B4)
10 (B5)
9 (A5)
7 (A4)
Typical Application Circuit/Functional Diagram
18 (D3)
FB+
IN+
IN-
FB-
GND
SHDN
27 (A1)
1 (B2)
CPGND
+
-
V
CC
26 (B1)
14, 22
(D1, D5)
C1N
MAX9730
The copper polygon to which the exposed pad is
attached should have multiple vias to the opposite side
of the PCB, where they connect to GND. Make this
polygon as large as possible within the system’s con-
straints.
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, go to the Maxim website at www.maxim-
ic.com/ucsp for the application note, UCSP—A Wafer-
Level Chip-Scale Package .
CPV
4.7μF
V
C1
DD
CHARGE
DD
CLASS G
4 (A3)
OUTPUT
PUMP
STAGE
C1P
3 (A2) 24 (C1)
WLP Applications Information
PV
0.1μF
SS
(C2, C4)
15, 21
SV
*
OUT+
OUT-
SS
FS
20 (D2)
16 (D4)
13 (C5)
C2
10μF
R
100kΩ
FS