TDA2003AV STMicroelectronics, TDA2003AV Datasheet - Page 14

• Manufacturer Part Number: TDA2003AV
• Manufacturer: STMicroelectronics

Specifications of TDA2003AV

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Application information
3.1.7
3.2
3.2.1
3.2.2
14/19
Figure 24. Output power and drain current vs.
Thermal shutdown
The presence of a thermal limiting circuit offers the following advantages:
1.
2.
Practical considerations
Printed circuit board
The layout shown in
points of input 1 and input 2 must be well decoupled from the ground of the output through
which a rather high current flows.
Assembly recommendations
No electrical insulation is required between the package and the heatsink. Pin length should
be as short as possible. The soldering temperature must not exceed 260 °C for 12 seconds.
case temperature (R
An overload on the output (even if it is permanent), or an excessive ambient
temperature can be easily withstood.
The heatsink can have a smaller factor compared with that of a conventional circuit.
There is no damage to the device in the case of excessive junction temperature: only
P
o
(and therefore P
Figure 21
L
= 4 Ω)
tot
) and Id are reduced.
Doc ID 018796 Rev 2
is recommended. If different layouts are used, the ground
Figure 25. Output power and drain current vs.
case temperature (R
L
= 2 Ω)
TDA2003A