W86L387D Winbond Electronics, W86L387D Datasheet - Page 17

• Manufacturer Part Number: W86L387D
• Manufacturer: Winbond Electronics

Specifications of W86L387D

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 70C
• Package Type: LQFP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

7.2
DMA request XDRQN is used to notify the Host that the Host should write data to the transmit data
buffer or read data from the receive data buffer in data write to the card or data read from the card.
During data transmit to the card, the XDRQN will active if the data write command has been transfer
to the card and the transmit data buffer have not enough data to transmit to the card. The XDRQN will
not active if the transmit data buffer have enough data to transmit to the card.
During data receive from the card, the XDRQN will active if the data read command has been transfer
to the card and the data have been received in the receive data buffer. The XDRQN will not active if
the data read command has been executed completely and the receive data buffer is read out.
There are two types of DMA acknowledge waveform, the first type is configured if DAKEN = low,
XDAKN is ignore and XDRQN will inactive after each access receive or transmit data buffer, the
XDRQN will re-active after four clock later. Figure 7-6 shows the waveform of DMA access receive
data buffer in DAKN = low. The second type is configured if DAKEN = high, XDAKN is used to count
the transfer count of the data buffer, XDRQN will hold at active state until the data has been
transferred completely. Figure 7-7 is the waveform of DMA access transmit data buffer in DAKN =
high.
DMA Access
A[3:1]
D[15:0]
XRDYN
XBE[1:0]
HCKI
XCSN
XASN
XRWN
Fig. 7-5 16-bit Read and Write Access in Host I/F Type 2, 2-Cycle Access.
Read cycle
DO[15:0]
- 15 -
Write cycle
Publication Release Date: May 13, 2005
DI[15:0]
W86L387D
Revision A1