5962-8959837MZA E2V, 5962-8959837MZA Datasheet - Page 52

• Manufacturer Part Number: 5962-8959837MZA
• Manufacturer: E2V

Specifications of 5962-8959837MZA

• Lead Free Status / Rohs Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
Die physical dimensions.
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
Interface materials.
Glassivation.
Substrate: Single crystal silicon
Assembly related information.
Die size: 15 860 X 5 410 microns
Die thickness: 475 microns
Top metallization: Aluminium + 1% Copper
Backside metallization: bare silicon
Type: Silicon Oxide + Nitride
Thickness: 15 000 Angstroms
Substrate potential: not connected
Special assembly instructions: None
STANDARD
Figure A-1, MMO-65608EV Bond Pad Locations and Functions – Continued
FORMS A PART OF SMD 5962-89598
APPENDIX C – Continued.
SIZE
A
REVISION LEVEL
R
SHEET
5962-89598
52