AM29DL161DB70EI Spansion Inc., AM29DL161DB70EI Datasheet - Page 5

• Manufacturer Part Number: AM29DL161DB70EI
• Manufacturer: Spansion Inc.

Specifications of AM29DL161DB70EI

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 21/20Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 8.5 to 9.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 2M/1M
• Supply Current: 16mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 11
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 12
Common Flash Memory Interface (CFI) . . . . . . . 22
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25
February 26, 2009 21533E6
Special Package Handling Instructions ..........................................9
Word/Byte Configuration .............................................................. 12
Requirements for Reading Array Data ......................................... 12
Writing Commands/Command Sequences .................................. 13
Simultaneous Read/Write Operations with Zero Latency ............ 13
Standby Mode .............................................................................. 13
Automatic Sleep Mode ................................................................. 13
RESET#: Hardware Reset Pin ..................................................... 14
Output Disable Mode ................................................................... 14
Autoselect Mode .......................................................................... 17
Sector/Sector Block Protection and Unprotection ........................ 18
Write Protect (WP#) ..................................................................... 19
Temporary Sector/Sector Block Unprotect ................................... 19
Secured Silicon Sector Flash Memory Region ............................. 21
Hardware Data Protection ............................................................ 21
Reading Array Data ...................................................................... 25
Reset Command .......................................................................... 25
Autoselect Command Sequence .................................................. 25
Enter Secured Silicon™ Sector/Exit Secured Silicon Sector Com-
mand Sequence ........................................................................... 26
Byte/Word Program Command Sequence ................................... 26
Chip Erase Command Sequence ................................................. 27
Table 1. Am29DL16xD Device Bus Operations ....................................12
Accelerated Program Operation ............................................... 13
Autoselect Functions ................................................................. 13
Table 2. Am29DL16xD Device Bank Divisions .....................................14
Table 3. Sector Addresses for Top Boot Sector Devices ......................15
Table 4. Secured Silicon™ Sector Addresses for Top Boot Devices... 15
Table 5. Sector Addresses for Bottom Boot Sector Devices .................16
Table 6. Secured Silicon™ Addresses for Bottom Boot Devices ......... 16
Table 7. Am29DL16xD Autoselect Codes, (High Voltage Method) ......17
Table 8. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................18
Table 9. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................18
Figure 1. Temporary Sector Unprotect Operation................................. 19
Figure 2. In-System Sector/Sector Block Protection and
Unprotection Algorithms........................................................................ 20
Factory Locked: Secured Silicon Sector Programmed and
Protected At the Factory ........................................................... 21
Customer Lockable: Secured Silicon Sector NOT Programmed or
Protected At the Factory ........................................................... 21
Low VCC Write Inhibit ............................................................... 22
Write Pulse “Glitch” Protection .................................................. 22
Logical Inhibit ............................................................................ 22
Power-Up Write Inhibit .............................................................. 22
Table 10. CFI Query Identification String .............................................. 22
Table 11. System Interface String......................................................... 23
Table 12. Device Geometry Definition .................................................. 23
Table 13. Primary Vendor-Specific Extended Query ............................ 24
Unlock Bypass Command Sequence ....................................... 26
Figure 3. Program Operation ................................................................ 27
D A T A
Am29DL16xD
S H E E T
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 50
Package and Pin Capacitance . . . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
Sector Erase Command Sequence .............................................. 27
Erase Suspend/Erase Resume Commands ................................ 28
Command Definitions ................................................................... 29
DQ7: Data# Polling ...................................................................... 30
RY/BY#: Ready/Busy# ................................................................. 31
DQ6: Toggle Bit I .......................................................................... 31
DQ2: Toggle Bit II ......................................................................... 32
Reading Toggle Bits DQ6/DQ2 .................................................... 32
DQ5: Exceeded Timing Limits ...................................................... 32
DQ3: Sector Erase Timer ............................................................. 32
Key To Switching Waveforms ...................................................... 37
Word/Byte Configuration (BYTE#) ............................................... 40
Erase and Program Operations ................................................... 41
Temporary Sector/Sector Block Unprotect ................................... 46
Alternate CE# Controlled Erase and Program Operations ........... 48
FBC048—48-Ball Fine-Pitch Ball Grid Array
8 x 9 mm package ........................................................................ 51
LAA064—64-Ball Fortified Ball Grid Array,
13 x 11 mm package .................................................................... 52
TS 048—48-Pin Standard TSOP ................................................. 53
VBF048—48-Ball Very Thin Profile Fine-Pitch Ball Grid Array .... 54
Figure 4. Erase Operation .................................................................... 28
Table 14. Am29DL16xD Command Definitions .................................... 29
Figure 5. Data# Polling Algorithm ......................................................... 30
Figure 6. Toggle Bit Algorithm .............................................................. 31
Table 15. Write Operation Status ......................................................... 33
Figure 7. Maximum Negative Overshoot Waveform............................. 34
Figure 8. Maximum Positive Overshoot Waveform ............................. 34
Figure 9. I
Sleep Currents)..................................................................................... 36
Figure 10. Typical I
Figure 11. Test Setup .......................................................................... 37
Table 16. Test Specifications ................................................................ 37
Figure 12. Input Waveforms and Measurement Levels ........................ 37
Figure 13. Read Operation Timings...................................................... 38
Figure 14. Reset Timings...................................................................... 39
Figure 15. BYTE# Timings for Read Operations .................................. 40
Figure 16. BYTE# Timings for Write Operations .................................. 40
Figure 17. Program Operation Timings ................................................ 42
Figure 18. Accelerated Program Timing Diagram ................................ 42
Figure 19. Chip/Sector Erase Operation Timings ................................. 43
Figure 20. Back-to-back Read/Write Cycle Timings ............................. 44
Figure 21. Data# Polling Timings (During Embedded Algorithms) ....... 44
Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 45
Figure 23. DQ2 vs. DQ6 ....................................................................... 45
Figure 24. Temporary Sector/Sector Block Unprotect Timing Diagram 46
Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 47
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings ................................................................................ 49
CC1
Current vs. Time (Showing Active and Automatic
CC1
vs. Frequency................................................... 36
5