DT28F160S3100 Intel, DT28F160S3100 Datasheet - Page 52
DT28F160S3100
Manufacturer Part Number
DT28F160S3100
Description
Manufacturer
Intel
Datasheet
1.DT28F160S3100.pdf
(52 pages)
Specifications of DT28F160S3100
Density
16Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
21/20Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
SSOP
Program/erase Volt (typ)
2.7/3.3/5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
2M/1M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DT28F160S3100
Manufacturer:
INT
Quantity:
6 000
Company:
Part Number:
DT28F160S3100
Manufacturer:
INT
Quantity:
6 000
Company:
Part Number:
DT28F160S3100
Manufacturer:
HITACHI
Quantity:
6 219
28F160S3, 28F320S3
NOTES:
1. Please call the Intel Literature Center at (800) 548-4725 to request Intel documentation. International customers should
2. Visit Intel’s World Wide Web home page at http://www.intel.com for technical documentation and tools.
52
contact their local Intel or distribution sales office.
Contact Intel/Distribution
Contact Intel/Distribution
Contact Intel/Distribution
Contact Intel/Distribution
Order Number
www.mcif.com
Sales Office
Sales Office
Sales Office
Sales Office
290609
292203
292204
290528
290489
297372
292123
292144
292159
292163
ADDITIONAL INFORMATION
Word-Wide FlashFile Memory
AP-645 28F160S3/S5 Compatibility with 28F016SA/SV
AP-646 Common Flash Interface (CFI) and Command Sets
Common Flash Interface Specification
28F016SV 16-Mb (1Mbit x 16, 2 Mbit x 8) FlashFile™ Memory Datasheet
28F016SA 16-Mb (1Mbit x 16, 2 Mbit x 8) FlashFile™ Memory Datasheet
16-Mbit Flash Product Family User’s Manual
AP-374 Flash Memory Write Protection Techniques
AP-393 28F016SV Compatibility with 28F016SA
AP-607 Multi-Site Layout Planning with Intel’s FlashFile™ Components,
Including ROM Capability
AP-610 Flash Memory In-System Code and Data Update Techniques
Mechanical Specification BGA* Package Preliminary Guide
Surface Mount and PCB Guidelines for BGA* Packaging
Multi-Site Layouts: 56-lead TSOP to 56-bump BGA* package
CFI - Common Flash Interface Reference Code
APPENDIX B
56-lead SSOP to 56-bump BGA package
Document/Tool
TM
ADVANCE INFORMATION
Family 28F160S5, 28F320S5 Datashee t
(1,2)