DT28F160S3100 Intel, DT28F160S3100 Datasheet - Page 52

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DT28F160S3100

Manufacturer Part Number
DT28F160S3100
Description
Manufacturer
Intel
Datasheet

Specifications of DT28F160S3100

Density
16Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
21/20Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
SSOP
Program/erase Volt (typ)
2.7/3.3/5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
2M/1M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DT28F160S3100
Manufacturer:
INT
Quantity:
6 000
Part Number:
DT28F160S3100
Manufacturer:
INT
Quantity:
6 000
Part Number:
DT28F160S3100
Manufacturer:
HITACHI
Quantity:
6 219
28F160S3, 28F320S3
NOTES:
1. Please call the Intel Literature Center at (800) 548-4725 to request Intel documentation. International customers should
2. Visit Intel’s World Wide Web home page at http://www.intel.com for technical documentation and tools.
52
contact their local Intel or distribution sales office.
Contact Intel/Distribution
Contact Intel/Distribution
Contact Intel/Distribution
Contact Intel/Distribution
Order Number
www.mcif.com
Sales Office
Sales Office
Sales Office
Sales Office
290609
292203
292204
290528
290489
297372
292123
292144
292159
292163
ADDITIONAL INFORMATION
Word-Wide FlashFile Memory
AP-645 28F160S3/S5 Compatibility with 28F016SA/SV
AP-646 Common Flash Interface (CFI) and Command Sets
Common Flash Interface Specification
28F016SV 16-Mb (1Mbit x 16, 2 Mbit x 8) FlashFile™ Memory Datasheet
28F016SA 16-Mb (1Mbit x 16, 2 Mbit x 8) FlashFile™ Memory Datasheet
16-Mbit Flash Product Family User’s Manual
AP-374 Flash Memory Write Protection Techniques
AP-393 28F016SV Compatibility with 28F016SA
AP-607 Multi-Site Layout Planning with Intel’s FlashFile™ Components,
Including ROM Capability
AP-610 Flash Memory In-System Code and Data Update Techniques
Mechanical Specification BGA* Package Preliminary Guide
Surface Mount and PCB Guidelines for BGA* Packaging
Multi-Site Layouts: 56-lead TSOP to 56-bump BGA* package
CFI - Common Flash Interface Reference Code
APPENDIX B
56-lead SSOP to 56-bump BGA package
Document/Tool
TM
ADVANCE INFORMATION
Family 28F160S5, 28F320S5 Datashee t
(1,2)

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