LPC47N217-JV Standard Microsystems (SMSC), LPC47N217-JV Datasheet - Page 5

• Manufacturer Part Number: LPC47N217-JV
• Manufacturer: Standard Microsystems (SMSC)

Specifications of LPC47N217-JV

• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

Package Outline
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC LPC47N217
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.
ccc
A1
A2
E1
L1
D1
W
A
D
E
H
L
e
θ
0.05
1.35
8.80
6.80
8.80
6.80
0.09
0.45
0.13
MIN
0
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~
~
Figure 2 - 64 Pin STQFP Package Outline, 7x7x1.4 Body, 2 MM Footprint
o
0.40 Basic
NOMINAL
1.00 REF.
1.40
9.00
7.00
9.00
7.00
0.60
0.18
Table 1 - 64 Pin STQFP Package Parameters
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~
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PRODUCT PREVIEW
MAX
1.60
0.15
1.45
9.20
7.20
9.20
7.20
0.20
0.75
0.23
0.08
7
~
o
Page 5
Overall Package Height
Lead Frame Thickness
Lead Foot Length
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
Lead Width
Coplanarity
REMARKS
Lead Pitch
Standoff
X Span
Y Span
Revision 0.2 (03-29-07)